Photocurable Resin Composition for Low-Temperature Curing
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Solution Overview
Problem
Existing photocurable resin compositions used in semiconductor and display manufacturing lack high visible light transmittance and heat resistance at temperatures above 250°C, and require baking at 200°C or higher, which can damage plastic substrates and reduce adhesive properties.
Innovation Solution
A photocurable resin composition with a polymer having a radical crosslinkable moiety at its terminal structure, combined with a radical photopolymerization initiator and solvent, that forms a cured film with high visible light transmittance, heat resistance, and solvent resistance without requiring a heating step above 200°C, using a specific polymer structure and photopolymerization process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a photocurable resin composition is baked at 200°C or above to achieve high visible light transmittance and heat resistance, then the cured film has excellent transmittance and heat resistance, but the plastic substrate is damaged and adhesive properties are reduced
Solution Approach 1:
The patent replaces the thermal curing mechanism (heating at 200°C or above) with a photocuring mechanism using photopolymerization initiators that activate under UV or visible light. This substitution allows the resin to cure at low temperatures, eliminating thermal damage to plastic substrates while still achieving high heat resistance and visible light transmittance in the cured film.
Solution Approach 2:
The patent changes the curing temperature parameter from high temperature (200°C or above) to low temperature (room temperature or slightly elevated temperatures). This is achieved by selecting photopolymerization initiators with appropriate activation energies that can be triggered by light rather than heat, fundamentally altering the processing conditions while maintaining or improving the final product properties.
2Strength
If a conventional adhesive is used to join semiconductor elements, then the bonding is achieved, but the adhesive cannot withstand temperatures of 250°C or above required for electrode joining or ion diffusion steps
Solution Approach 1:
The patent creates a composite adhesive system combining organic resin components with photopolymerization initiators and crosslinking agents. This composite formulation achieves both room-temperature processing compatibility (for plastic substrates) and high-temperature resistance (withstanding 250°C or above), as the crosslinked network structure provides thermal stability while the photocuring mechanism enables low-temperature application.
3Illumination intensity
If a photocurable resin composition requiring high-temperature baking is used, then the cured film has high visible light transmittance, but the processing cost increases and production efficiency decreases
Solution Approach 1:
The patent replaces the thermal energy input system (ovens, heating elements, long baking cycles) with an optical energy input system (UV or visible light sources). This substitution dramatically reduces processing time from hours to seconds or minutes, eliminates the need for expensive high-temperature equipment, and enables rapid production while maintaining high visible light transmittance in the cured film.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high visible light transmittance, excellent heat resistance, and solvent resistance, along with improved adhesion and anti-moisture permeation properties, making it suitable for applications in organic EL displays and image sensors without the need for high-temperature baking.
Implementation Method 1
a radical photopolymerization initiator; and a solvent, wherein the polymer has a structure of formula (2) at an end and has a weight average molecular weight of 1,000 to 50,000
Data Source
AI summary
A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a C1-6 alkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the —O— group in formula (1); and R1 is a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent.