Photocurable Resin For 3D Printing With High Heat Deflection
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Solution Overview
Problem
Existing 3D printing materials for SLA and DLP technologies lack advanced properties such as high heat deflection temperature, impact strength, and elasticity, limiting their application in high-temperature environments like electronics and automotive components.
Innovation Solution
A composition comprising highly crosslinkable acrylate monomers with four or more functional groups and elastic urethane acrylate oligomers, achieving a heat deflection temperature of at least 80°C, optimized for inkjet, SLA, and DLP deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional photocurable compositions are used for 3D printing, then the material is easy to process and cure, but the heat deflection temperature is insufficient for high-temperature applications
Solution Approach 1:
The patent changes the chemical parameters of the photocurable composition by incorporating highly crosslinkable monomers with specific functional group counts (3 or more, preferably 4-6) and high Tg values (greater than 100°C, preferably greater than 150°C). This parameter change in monomer structure and composition directly increases the heat deflection temperature of the cured material while maintaining photocurability.
Solution Approach 2:
The patent creates a composite photocurable system combining highly crosslinkable monomers (such as ethoxylated pentaerythritol tetraacrylate) with elastic oligomers (such as polyurethane acrylates). This composite material approach integrates materials with complementary properties: the highly crosslinkable monomer provides high Tg and crosslinking density for thermal stability, while the elastic oligomer provides flexibility and processability.
2Temperature
If highly crosslinked networks are formed to increase heat resistance, then thermal stability improves, but the material becomes brittle and loses impact strength
Solution Approach 1:
The patent adjusts the functional group count parameter of monomers to 3 or more (preferably 4-6), which optimizes crosslinking density without excessive brittleness. This specific parameter range allows sufficient crosslinking for thermal stability while avoiding over-crosslinking that would cause brittleness and reduce impact strength.
Solution Approach 2:
The patent combines highly crosslinkable monomers with elastic oligomers (such as polyurethane acrylates with specific molecular weights and softness). This composite approach creates a balanced network where the highly crosslinkable monomer provides thermal stability through dense crosslinking, while the elastic oligomer components maintain flexibility and impact strength by providing softer, more compliant segments in the cured network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides 3D printed articles with enhanced thermal stability and mechanical strength, suitable for high-temperature applications by maintaining physical characteristics and resisting deformation.
Implementation Method 1
Photocurable compositions are materials used in 3D printing techniques using light source(s) to cure (polymerize) a network of a monomer and oligomer, initiating radical polymerization using a photoinitiator.
Data Source
AI summary
Described herein are photopolymerizable compositions for use in 3D printing. The compositions contain highly crosslinkable acrylate monomers, elastic urethane acrylate oligomers, photoinitiator and optionally carbon black. The compositions, after photopolymerization, have a high heat deflection temperature (for example, at least 80C), while maintaining strong mechanical properties, such as E modulus, tensile strength, and elongation at break. Also described are methods for fabricating three dimensional objects utilizing these compositions, and three dimensional objects made from these compositions.