Photocurable Acrylic Resin for Uniform Microstructure Imprinting
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Solution Overview
Problem
Existing light curing acrylic resins used in imprinting molding face issues with non-uniform layer thickness leading to uneven peel forces and deformation of micro concave-convex structures, as well as poor followability of the uncured resin composition, which affects the transfer of these structures and reduces optical properties.
Innovation Solution
A light curing acrylic resin composition containing specific photopolymerization components, including (octahydro-4,7-methano-1H-indenediyl)bis(methylene) diacrylate and bifunctional acrylate monomers with controlled viscosities, along with optional monofunctional and polyfunctional acrylate monomers, to achieve low viscosity and high heat tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If the content of monofunctional monomer and low-viscosity bifunctional monomer is increased to lower the viscosity of the uncured resin composition, then the viscosity decreases and layer thickness uniformity improves, but the heat tolerance of the cured resin layer decreases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the viscosity of the bifunctional acrylate monomer (≤10 mPa·s at 25°C) and setting specific content ranges: monofunctional monomer at 10-50 mass% and bifunctional monomer at 30-60 mass%. This optimized parameter combination achieves low overall viscosity (≤35 mPa·s) while maintaining heat tolerance through the specific molecular structure of (octahydro-4,7-methano-1H-indenediyl)bis(methylene) diacrylate
Solution Approach 2:
The patent uses composite materials by combining three types of acrylate monomers (monofunctional, bifunctional, and polyfunctional) in specific proportions. The bifunctional monomer with low viscosity (≤10 mPa·s) serves as the base, monofunctional monomer (10-50 mass%) provides flowability, and polyfunctional monomer (0-20 mass%) enhances crosslinking density for heat resistance, creating a composite resin system that balances low viscosity with high heat tolerance
2Ease of operation
If the viscosity of the uncured resin composition is reduced to improve followability to the micro concave-convex shape, then the followability improves and structure transfer becomes effective, but the peel force uniformity during master peeling deteriorates due to non-uniform layer thickness
Solution Approach 1:
The patent applies parameter changes by optimizing the viscosity of the uncured resin composition to ≤35 mPa·s through selecting specific monomers and ratios. This viscosity range is critical: low enough to ensure the resin flows and follows the micro concave-convex shape of the master during imprinting, yet high enough to maintain uniform layer thickness that prevents non-uniform peel forces during master removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition maintains low viscosity for uniform layer formation and excellent heat tolerance, ensuring effective transfer of micro concave-convex structures while preserving optical properties.
Implementation Method 1
containing a photopolymerization component (13) The photopolymerization component contains a resin (A), and a resin (B).
Data Source
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AI summary
Provided is a light curing acrylic resin for imprinting in which an uncured resin composition has a low viscosity and in which a resin composition after curing is excellent in heat tolerance. The light curing acrylic resin for imprinting is a light curing acrylic resin for imprinting containing a photopolymerization component. The photopolymerization component contains a resin (A), and resin (B). The resin (A) is (octahydro-4,7-methano-1H-indenediyl)bis(methylene) diacrylate. The resin (B) is a bifunctional acrylate monomer having a viscosity of less than or equal to 10 mPa•s at 25°C. A content of the resin (A) in a whole of the photopolymerization component is more than or equal to 20 mass % and less than or equal to 40 mass %. A total content of the resin (A) and the resin (B) in the whole of the photopolymerization component is less than or equal to 70 mass %.