Photocurable Resin Composition for Semiconductor Solder Resist
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Solution Overview
Problem
Conventional alkali developing-type photosolder resists for printed wiring boards lack durability in terms of alkali resistance, water resistance, and heat resistance, often experiencing cracks and detachment due to thermal shock, and have limitations in PCT and HAST resistance, especially in semiconductor packages with high-moisture and high-temperature conditions.
Innovation Solution
A photocurable/thermosetting resin composition comprising a carboxyl group-containing photosensitive resin, a photopolymerization initiator, a block copolymer, and a thermosetting component, which forms a cured coating film with enhanced thermal shock resistance, PCT resistance, and electroless gold plating resistance, using a block copolymer with specific glass transition temperatures and a thermosetting component to improve durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a hydrophilic group is used to provide alkali developability, then alkali developability is improved, but chemical resistance and adhesion deteriorate due to infiltration of chemical solution, water, steam or the like
Solution Approach 1:
The patent modifies the chemical structure of the resin by changing the hydrophilic group from carboxyl to hydroxyl, which alters the balance between alkali developability and chemical resistance. This parameter change in the resin composition allows maintaining alkali developability while improving resistance to chemical solution infiltration
Solution Approach 2:
The patent uses a composite resin system combining hydroxyl group-containing resin with epoxy resin and unsaturated monomer. This composite material approach allows the hydroxyl group to provide alkali developability while the epoxy resin matrix provides chemical resistance, achieving both improved developability and maintained reliability
2Ease of operation
If conventional alkali developing-type photosolder resist is used, then ease of development is improved, but thermal shock resistance deteriorates causing cracks and detachment
Solution Approach 1:
The patent changes the functional group from carboxyl to hydroxyl in the resin composition, which fundamentally alters the thermal and mechanical properties. This parameter change results in improved thermal shock resistance while preserving alkali developability, eliminating cracks and detachment issues
Solution Approach 2:
The patent introduces a silane coupling agent that locally modifies the interface between the resin and substrate. This local quality enhancement improves adhesion and thermal shock resistance at the interface without affecting the overall alkali developability of the resist layer
3Ease of operation
If conventional alkali developing-type photosolder resist is used, then development capability is improved, but PCT and HAST resistance are insufficient under high-moisture and high-temperature conditions
Solution Approach 1:
The patent fundamentally changes the resin composition by replacing carboxyl group with hydroxyl group and adding silane coupling agent. This parameter change creates a resin system with superior moisture and heat resistance, achieving both improved development capability and enhanced PCT/HAST resistance
Solution Approach 2:
The silane coupling agent acts as an intermediary between the resin and the substrate/environment. It creates a protective interface that improves adhesion and provides barrier properties against moisture and heat, thereby enhancing PCT and HAST resistance while maintaining development capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent thermal shock resistance, PCT resistance, HAST resistance, and electroless gold plating resistance, addressing the durability issues of conventional alkali developing-type photosolder resists and ensuring reliable performance in semiconductor packages under harsh conditions.
Implementation Method 1
a photocurable/thermosetting resin composition which is suitable for a solder resist of a printed wiring board and the like, particularly a resist for an IC package
Implementation Method 2
a block copolymer and (D) a thermosetting component, which forms a cured coating film with enhanced thermal shock resistance
Implementation Method 3
a thermosetting component, which forms a cured coating film with enhanced thermal shock resistance, PCT resistance, and electroless gold plating resistance
Data Source
AI summary
Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.