Photocurable Silane Adhesive for Substrate Resin Bonding
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Solution Overview
Problem
The challenge lies in developing an adhesive composition that can achieve uniform adhesion over large areas and enhance interfacial adhesion force between heterogeneous materials, such as silicon or glass substrates and fluorine-based polymers, while maintaining light transmittance and avoiding peeling phenomena in optical and electronic devices.
Innovation Solution
A photocurable adhesive composition incorporating an organic functional silane compound with specific functional groups and a silane compound, applied through methods like spin coating, to form a thin layer with excellent adhesion properties and uniformity, utilizing Chemical Formulas 1 and 2, which include specific alkyl and aryl substitutions, and a pH adjuster and solvent for optimal hydrolysis and condensation reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a self-assembled monolayer is formed on the substrate to improve adhesion force, then adhesion force is improved, but the method cannot be applied to large area substrates and does not secure uniformity of the adhesion layer
Solution Approach 1:
The patent replaces the mechanical/chemical process of self-assembled monolayer formation (immersing substrate in solution or chemical vapor deposition) with a spin-coating process that applies adhesive composition uniformly across large substrate areas. This substitution enables scalable manufacturing while maintaining adhesion force through the photocurable adhesive composition containing silane compounds and organic functional groups.
Solution Approach 2:
The patent changes the parameters of the adhesion promotion method by using a spin-coating process with controlled rotational speed and time to achieve uniform thin film formation over large areas. The adhesive composition parameters (silane compound concentration, organic functional group types) are optimized to ensure both large-area coverage and strong adhesion force.
2Ease of manufacture
If conventional adhesives are used for heterogeneous materials like silicon substrate and fluorine-based polymer, then manufacturing is simple, but adhesion force is weak and peeling phenomenon occurs
Solution Approach 1:
The patent uses a composite adhesive composition containing silane compounds (for substrate bonding), organic functional groups (for resin compatibility), and photocurable components. This composite formulation specifically addresses the heterogeneous interface between silicon/glass substrates and fluorine-based polymers, providing strong adhesion while maintaining ease of manufacture through a single coating and curing process.
Solution Approach 2:
The adhesive composition acts as an intermediary material between the inorganic substrate (silicon/glass) and the organic fluorine-based polymer. The silane compounds bond to the substrate while the organic functional groups interact with the polymer, creating a bridge that ensures strong adhesion across the heterogeneous interface.
3Manufacturing precision
If a thin layer is formed by spin coating to achieve uniformity, then adhesion uniformity is improved, but application to large area substrates becomes difficult
Solution Approach 1:
The spin-coating process is made universal for both small and large area substrates by optimizing the coating head design and rotational parameters. The adhesive composition formulation ensures uniform film formation across varying substrate sizes, making the process applicable from laboratory-scale to industrial-scale manufacturing while maintaining adhesion uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition ensures strong adhesion between both homogeneous and heterogeneous materials, facilitates the formation of uniform thin layers over large areas, and improves light transmittance, with enhanced storage stability and reduced foreign material occurrence during coating.
Implementation Method 1
a pH adjuster and solvent for optimal hydrolysis and condensation reactions
Implementation Method 2
a pH adjuster and solvent for optimal hydrolysis and condensation reactions
Implementation Method 3
adhesive composition capable of adhering an interface between a substrate and a photocurable resin
Data Source
AI summary
The present invention relates to an adhesive composition capable of improving adhesion force between two interfaces through thermal crosslinking and photo-crosslinking of a substrate and a resin, or a resin and a resin, in processes for optical devices and electronic devices, and a preparation method thereof. Specifically, the present invention relates to an adhesive composition capable of adhering an interface between a substrate and a photocurable resin, and a method of adhering an interface using the same.