Thermal-Aging Photocurable Silicone Composition for Crack Resistance

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Solution Overview

Problem

Photocurable silicone compositions used in optical devices and image displays suffer from cracking and delamination after thermal aging.

Innovation Solution

A photocurable silicone composition comprising organopolysiloxane, an organic compound with ether bonds and aliphatic carbon-carbon double bonds, thiol group-containing compounds, and a photoradical initiator, with optional additives like hindered phenol compounds and radical scavengers, to enhance crack resistance and adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a photocurable silicone composition comprising organopolysiloxane with aryl groups, organic compound with ether bonds and aliphatic carbon-carbon double bonds, thiol group-containing compounds, and photoradical initiator is used, then the cured product achieves good adhesion and crack resistance after thermal aging, but the composition complexity increases

Engineering Contradiction:
Improvecrack resistance and adhesion after thermal agingVSAvoidcomposition complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a composite material system combining organopolysiloxane (A) with specific aryl group content, organic compound (B) containing ether bonds and aliphatic carbon-carbon double bonds, thiol group-containing compound (C) with specific functional groups, and photoradical initiator (D). This multi-component composite formulation achieves synergistic effects that improve crack resistance and adhesion after thermal aging while maintaining optical clarity, resolving the contradiction between reliability and composition complexity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes specific parameters including the aryl group content in organopolysiloxane (0.5-5.0 mmol/g), the structural characteristics of organic compound (B) with ether bonds and aliphatic carbon-carbon double bonds, and the functional group content in thiol group-containing compound (C). By precisely controlling these parameters within specific ranges, the cured product achieves enhanced reliability regarding crack resistance and adhesion while avoiding excessive composition complexity.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the organopolysiloxane contains sufficient aryl groups for adhesion, then the cured product maintains good adhesion after thermal aging, but the manufacturing precision of controlling group content becomes more difficult

Engineering Contradiction:
Improveadhesion after thermal agingVSAvoidcontrol of aryl group content
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent specifies a quantitative parameter range for aryl group content in organopolysiloxane (A) as 0.5-5.0 mmol/g, which provides a clear manufacturing target. This parameter optimization ensures sufficient adhesion after thermal aging while being practically controllable in production, resolving the contradiction between reliability and manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the organic compound with ether bonds and aliphatic carbon-carbon double bonds is used in higher amounts, then the crack resistance improves, but the cost of materials increases

Engineering Contradiction:
Improvecrack resistanceVSAvoidmaterial cost
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent optimizes the content ratio of organic compound (B) containing ether bonds and aliphatic carbon-carbon double bonds within the overall composition. By controlling this parameter within an optimal range, the cured product achieves sufficient crack resistance while minimizing material costs, resolving the contradiction between reliability and quantity of substance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition forms a cured product that suppresses cracking and delamination, maintaining adhesion and optical clarity under thermal stress.

Implementation Method 1

a photocurable silicone composition comprising: (A) 100 parts by mass of an organopolysiloxane having at least one aryl group with 6 to 12 carbons and at least one alkenyl group with 2 to 12 carbons in a molecule; (B) from 1 to 50 part(s) by mass of an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) from 4 to 40 parts by mass of a thiol group-containing organic compound; and (D) from 0.05 to 2 parts by mass of a photoradical initiator

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

The photocurable silicone composition cures by irradiation with an active energy ray to form a cured product

Methodology Applied
Scientific EffectPhotochemical reaction: Photo-oxidation

Data Source

PatentUS12371534B2Photocurable silicone composition and cured product thereof
Publication Date: 2025.07.29 DOW TORAY CO LTD

AI summary

A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed. The photocurable silicone composition comprises: (A) an organopolysiloxane having at least one aryl group with 6 to 12 carbons and at least one alkenyl group with 2 to 12 carbons in a molecule; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a thiol group-containing organic compound comprising; (C1) an organic compound having two thiol groups in a molecule, and (C2) an organic compound having at least three thiol groups in a molecule; and (D) a photoradical initiator. The composition generally suppresses crack and delamination of a cured product laminated between two substrates after thermal aging.