Photocurable Composition for Solder Mask Thermal Aging Resistance
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Solution Overview
Problem
Current photocurable compositions for solder masks exhibit inadequate thermal aging resistance, crack resistance, and flux compatibility.
Innovation Solution
A photocurable composition comprising an epoxy resin with two or more epoxy groups, a binder with at least one carboxyl group, a photopolymerization initiator, and a filler composition of silica, talc, and wollastonite, which is used to create an insulating layer with improved properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin composition with fused silica or wollastonite filler is used, then the composition can be formulated for solder mask applications, but the thermal aging resistance, crack resistance, and flux compatibility are insufficient
Solution Approach 1:
The patent uses a composite filler system comprising silica, talc, and wollastonite in specific weight ratios (silica: 20-40%, talc: 10-30%, wollastonite: 10-30%) to achieve improved thermal aging resistance, crack resistance, and flux compatibility simultaneously. This composite approach allows the material to benefit from the complementary properties of each filler type, resolving the contradiction between reliability and adaptability.
Solution Approach 2:
The patent modifies the chemical composition parameters of the epoxy resin system by selecting specific epoxy resins with appropriate molecular structures and crosslinking densities. By adjusting the resin composition and curing agent ratios, the patent achieves optimal balance between thermal stability and chemical resistance to flux, thereby improving both thermal aging resistance and flux compatibility.
2Strength
If high amount of filler is used in epoxy composition, then crack resistance may improve, but solvent resistance deteriorates
Solution Approach 1:
The patent optimizes the filler content within a controlled range (total filler: 30-50% by weight) and adjusts the resin-to-filler ratio to maintain adequate solvent resistance. By precisely controlling these compositional parameters and using a multi-component filler system, the patent achieves crack resistance without sacrificing solvent resistance.
3Ease of manufacture
If conventional epoxy composition is used, then manufacturing is simple, but performance in thermal aging and crack resistance is inadequate
Solution Approach 1:
The patent employs a composite filler system (silica, talc, wollastonite) that can be readily mixed and processed using conventional manufacturing techniques. The composition maintains ease of manufacture through standard mixing and curing processes while achieving superior crack resistance through the synergistic effects of the composite filler architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition demonstrates enhanced thermal aging resistance, crack resistance, and flux compatibility, making it suitable for solder mask applications.
Implementation Method 1
a photopolymerization initiator
Data Source
AI summary
This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.