Photocurable Stepped Substrate Coating Composition for Planarization
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Solution Overview
Problem
Conventional resist underlayer film-forming compositions experience issues with filling patterns due to increased viscosity and heat shrinkage during crosslinking, leading to poor planarization and flatness on substrates with stepped structures.
Innovation Solution
A photocurable stepped substrate coating composition comprising specific partial structures and a solvent, where the epoxy group and hydroxy group are in a controlled molar ratio, and the partial structures include unsaturated bonds for crosslinking without thermal or acid catalysts, allowing for photoreaction without degasification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal crosslinking is used to improve planarization, then adhesion and crosslinking strength are improved, but viscosity increases during heating and filling into patterns becomes poor
Solution Approach 1:
The patent replaces thermal crosslinking with photocrosslinking using photopolymerizable groups and photoinitiators. This substitution eliminates the need for thermal heating during crosslinking, preventing viscosity increase and maintaining good filling properties into patterns while still achieving strong crosslinking and planarization.
Solution Approach 2:
The patent changes the crosslinking activation parameter from thermal energy to light energy. By using photopolymerizable groups that react upon light irradiation instead of thermal crosslinking that requires heating, the composition achieves crosslinking without the harmful viscosity increase that occurs during thermal processing.
2Strength
If thermal crosslinking with acid catalyst is used to improve adhesion, then crosslinking efficiency is improved, but heat shrinkage and degasification occur impairing flatness
Solution Approach 1:
The patent replaces thermal crosslinking with acid catalyst with photocrosslinking using photopolymerizable groups and photoinitiators. This substitution eliminates heat generation during crosslinking, preventing heat shrinkage and degasification that would otherwise impair the flatness of the coated film, while still achieving strong adhesion through crosslinking.
Solution Approach 2:
The patent converts the harmful effects of thermal processing (heat shrinkage, degasification) into a beneficial photocrosslinking process. By using light-initiated polymerization instead of thermal crosslinking, the composition achieves crosslinking without the harmful side effects, maintaining excellent flatness while still providing strong adhesion.
3Productivity
If conventional photocrosslinking material is used to improve filling property, then crosslinking speed is improved, but viscosity increases during crosslinking reaction
Solution Approach 1:
The patent changes the crosslinking activation method from thermal to photonic. By using photopolymerizable groups with specific absorption characteristics and appropriate photoinitiators, the composition achieves rapid crosslinking upon light irradiation without the viscosity increase that occurs during thermal crosslinking reactions.
Solution Approach 2:
The patent replaces thermal activation with photonic activation for crosslinking. This substitution allows crosslinking to proceed rapidly upon light exposure without generating heat that would increase viscosity, thereby maintaining good filling properties while achieving fast crosslinking speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent filling properties and maintains flatness by forming a crosslinked structure through photoreaction, preventing heat shrinkage and ensuring a planarized film on substrates with complex patterns.
Implementation Method 1
a compound (E) containing a partial structure (I) and a partial structure (II)... the partial structure (I) is at least one partial structure selected from the group consisting of partial structures of Formula (1-1) to Formula (1-5)... having a photopolymerizable group
Data Source
AI summary
A stepped substrate coating composition includes: a compound (E) containing partial structures (I) and (II) and a solvent (F). The partial structure (II) contains a hydroxy group generated by an epoxy group and a proton-generating compound reaction; the partial structure (I) is at least one partial structure selected from partial structures of Formula (1-1) to Formula (1-5) or a partial structure combining a partial structure of Formula (1-6) and Formula (1-7) or Formula (1-8); and the partial structure (II) is a partial structure of Formula (2-1) or Formula (2-2). The photocurable stepped substrate coating composition wherein in the compound (E), the epoxy group and the hydroxy group are contained in a molar ratio of 0≤(Epoxy group)/(Hydroxy group)≤0.5 and the partial structure (II) is contained in a molar ratio of 0.01≤(Partial structure (II))/(Partial structure (I)+Partial structure (II))≤0.8.