Photodegradable Base Resist Composition for Scum Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional resist compositions struggle to sufficiently suppress the generation of scum (resist residue) during the development process, especially as pattern miniaturization advances in semiconductor and liquid crystal display element production.
Innovation Solution
A resist composition that generates an acid upon exposure and contains a base material component with acid-decomposable groups, an acid generator component, and a photodegradable base to control acid diffusion, utilizing a compound represented by a specific general formula to reduce scum formation during development.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist composition is used for pattern miniaturization, then lithography characteristics such as resolution are improved, but scum (resist residue) generation after development increases
Solution Approach 1:
The patent introduces a photodegradable base as an intermediary substance that mediates between the acid generator component and the base material component. This photodegradable base controls acid diffusion by degrading upon exposure to light, thereby preventing excessive acid migration to unexposed areas while maintaining the desired lithography characteristics. The intermediary substance resolves the contradiction by enabling precise acid diffusion control without compromising pattern resolution.
Solution Approach 2:
The patent changes the chemical parameters of the resist composition by incorporating a photodegradable base with specific structural characteristics. This parameter change enables dynamic control of acid diffusion behavior during the exposure and development process. By adjusting the photodegradable base's degradation properties, the system achieves both improved lithography characteristics and reduced scum generation through optimized acid diffusion control.
2Manufacturing precision
If acid diffusion is controlled to improve lithography characteristics, then pattern resolution is enhanced, but scum suppression becomes insufficient
Solution Approach 1:
The patent applies preliminary action by incorporating the photodegradable base into the resist composition before exposure. This substance is pre-positioned to control acid diffusion during the exposure process, preventing acid from migrating to unexposed areas before development occurs. The preliminary control of acid diffusion maintains sharp pattern boundaries while the photodegradable base's exposure-dependent degradation prevents scum formation during subsequent development.
Solution Approach 2:
The photodegradable base acts as an intermediary that bridges the conflict between acid diffusion control and scum suppression. It enables precise spatial control of acid distribution while its degradation upon exposure eliminates residual acid that would otherwise cause scum. This intermediary mechanism simultaneously achieves both improved pattern resolution and effective scum suppression.
3Manufacturing precision
If photoreactive quencher with cation moiety is used to control acid diffusion, then lithography characteristics are improved, but scum generation cannot be sufficiently suppressed
Solution Approach 1:
The patent changes the fundamental parameter of acid diffusion control mechanism by replacing the photoreactive quencher with a photodegradable base. This parameter change transforms the control strategy from chemical quenching to physical degradation-based control. The photodegradable base provides superior scum suppression by completely degrading upon exposure, eliminating any residual material that could form scum, while maintaining effective acid diffusion control for improved lithography characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed resist composition effectively reduces scum formation and improves lithography characteristics by controlling acid diffusion and solubility changes in the developing solution, enabling better pattern formation.
Implementation Method 1
an acid generator component (B) generating an acid upon exposure
Implementation Method 2
a photodegradable base (D0) controlling diffusion of the acid generated from the acid generator component (B) upon exposure
Data Source
AI summary
A resist composition containing: a base material component exhibiting changed solubility in a developing solution under action of acid; an acid generator component generating an acid upon exposure; and a photodegradable base controlling diffusion of the acid generated from the acid generator component upon exposure, in which the photodegradable base contains a compound represented by General Formula (d0), in which R011 represents an aryl group having an electron-withdrawing group, R021 and R022 each independently represent an aryl group which may have a substituent, Z represents a sulfur atom, an oxygen atom, a carbonyl group, or a single bond, and X− represents a counter anion