Photodegradable Transfer Material for High-Resolution Circuit Patterns
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing film-type photodegradable transfer materials face challenges in achieving high resolution and preventing photosensitivity deterioration due to the presence of a support film, which also causes adhesion issues between the mask and photoresist layer during exposure.
Innovation Solution
A film-type photodegradable transfer material comprising a support film, a resin protection layer with low adhesion force, and a photodegradable photoresist layer, where the resin protection layer is formed with an acrylic acid polymer and includes an alkali-soluble resin and a diazide photosensitive compound, allowing for exposure without the support film, thereby minimizing distance between the mask and photosensitive resin layer and preventing foreign body interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a support film is used to support the photoresist layer, then the photoresist layer can be easily handled during exposure, but the distance between the mask and photoresist layer increases, reducing resolution
Solution Approach 1:
The invention extracts and removes the support film from the traditional dry film photoresist structure. By eliminating the support film, the photoresist layer can be applied directly to the substrate, reducing the distance between the mask and photoresist layer during exposure, thereby improving resolution while maintaining handling ease through alternative application methods
Solution Approach 2:
The invention segments the traditional integrated support film-photoresist layer structure into separate components. The photoresist layer is applied directly to the substrate without the support film, allowing the photoresist to be in direct contact with the mask during exposure, thus improving resolution while the substrate itself provides the necessary support
2Manufacturing precision
If the support film is removed before exposure to improve resolution, then the distance between mask and photoresist layer is minimized, but photosensitivity deteriorates due to air exposure
Solution Approach 1:
The invention applies the photoresist layer directly to the substrate before exposure, eliminating the need for a support film. This preliminary configuration ensures that the photoresist layer is in direct contact with the substrate, preventing air exposure and photosensitivity deterioration while maintaining the minimized distance between mask and photoresist layer for high resolution
Solution Approach 2:
The substrate serves as an intermediary that directly supports the photoresist layer without requiring a separate support film. This direct bonding eliminates the air gap that would cause photosensitivity deterioration while maintaining the close proximity needed for high-resolution exposure
3Strength
If a cover film is used to protect the photoresist layer, then the photoresist layer is prevented from damage, but adhesion between the mask and photoresist layer occurs during contact-type exposure
Solution Approach 1:
The invention removes the cover film from the traditional dry film photoresist structure. By eliminating the cover film, there is no intermediate layer between the mask and photoresist layer during contact-type exposure, preventing adhesion issues while the photoresist layer remains protected through direct application to the substrate
Solution Approach 2:
Instead of using a cover film to protect the photoresist layer, the invention inverts the protection approach by having the photoresist layer directly bonded to the substrate, which provides the necessary protection and support without causing mask adhesion during exposure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances resolution, prevents photosensitivity deterioration, and simplifies the exposure process by allowing contact-type exposure after support film removal, reducing production costs and improving workability.
Implementation Method 1
In the case of the positive-type dry film photoresist, a photodegradation reaction is conducted at its light exposed site and thus developed with alkali, and a resist pattern is formed on its non-exposed site
Data Source
AI summary
Disclosed herein is a film-type photodegradable transfer material, comprising: a support film; a resin protection layer; a photodegradable photoresist layer; and a cover film, wherein the resin protection layer has an adhesion force of 0.05 kgf or less. When the film-type photodegradable transfer material is used to form a fine circuit pattern, such as a printed circuit board or the like, the resolution of the pattern can be increased by minimizing the distance between a mask and a photosensitive resin layer at the time of exposure, and work can be performed in the form of a sheet or a roll to roll process can be applied to the work even when the support film has been removed before an exposure process.