Photodetection Element With Localized Schottky Junctions
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Solution Overview
Problem
Existing photodetection elements struggle to detect near infrared light with sufficient sensitivity while minimizing dark current, particularly due to the complexity and cost of compound semiconductor fabrication and the limitations of PN junction and Schottky junction types.
Innovation Solution
A Schottky junction type photodetection element with a periodic concave/convex structure on the semiconductor layer, where the Schottky junction is formed on the base end side of the convex portions and a non-Schottky junction on the distal end side, optimizing light absorption and reducing dark current by localizing the junction areas based on absorption contributions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a metal film is provided to cover the periodic concave/convex structure, then the light absorption is improved, but the Schottky junction area increases causing dark current to increase
Solution Approach 1:
The patent applies local quality by creating different junction types in different regions of the periodic concave/convex structure. Specifically, Schottky junctions are formed only in the concave portions where light absorption is enhanced, while convex portions have non-Schottky junctions (such as ohmic junctions or insulating layers). This localized differentiation allows the structure to maximize light absorption in concave regions without increasing dark current across the entire surface, as convex regions do not contribute to dark current generation.
2Ease of manufacture
If a PN junction type photodetection element is used, then the fabrication is simple, but the detection limit is restricted to wavelengths shorter than silicon band gap (equal to or greater than 1100 nm)
Solution Approach 1:
The patent employs composite materials by combining silicon semiconductor layer with metal film layers to form a Schottky junction structure. This composite approach enables the detection of near-infrared light with wavelengths longer than the silicon band gap limit, achieving detection up to approximately 1700 nm. The metal-semiconductor composite structure maintains compatibility with standard silicon fabrication processes while extending the detection capability beyond what pure silicon PN junctions can achieve.
3Measurement precision
If a Schottky junction type photodetection element with full metal film coverage is used, then the sensitivity is improved, but the dark current increases due to increased Schottky junction area
Solution Approach 1:
The patent applies segmentation by dividing the periodic concave/convex structure into functionally distinct regions: concave portions that form Schottky junctions for high sensitivity detection, and convex portions that form non-Schottky junctions to minimize dark current. This segmentation strategy maintains high detection sensitivity by concentrating Schottky junctions in light-absorbing concave regions while eliminating dark current sources from convex regions, thereby improving the signal-to-noise ratio without sacrificing sensitivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances sensitivity for near infrared light detection while suppressing dark current, allowing for efficient light absorption and reduced dark current, thus improving the overall performance of the photodetection element.
Implementation Method 1
a periodic concave/convex structure that includes periodic convex portions and concave portions and converts light into surface plasmons
Implementation Method 2
free electrons are excited due to light absorption inside a metal film, and the generated excited electrons (hot carriers) flow as a photocurrent
Implementation Method 3
free electrons are excited due to light absorption inside a metal film, and the generated excited electrons (hot carriers) flow as a photocurrent to a semiconductor side beyond the Schottky barrier
Implementation Method 4
the generated excited electrons (hot carriers) flow as a photocurrent to a semiconductor side beyond the Schottky barrier
Data Source
AI summary
A photodetection element includes a semiconductor layer having, on one surface side, a periodic concave/convex structure that includes periodic convex portions and concave portions and converts light into surface plasmon, and a metal film provided on the one surface side of the semiconductor layer in correspondence to the periodic concave/convex structure, and in the periodic concave/convex structure, a Schottky junction portion that has a Schottky junction with the metal film is provided on a base end side of the convex portion, and a non-Schottky junction portion that does not have a Schottky junction with the metal film is provided on a distal end side of the convex portion.


