Integrated Photodetector Carrier Capture for Spectrometer Alignment

The patent merges the light entrance member and photodiode array into a single integrated structure where the light entrance member is formed directly on the substrate in predetermined positional relationship with the photodiode array elements. This integration eliminates the need for separate alignment steps while maintaining high positioning precision, as the components are positioned relative to each other during the same manufacturing process.

The patent implements preliminary positioning by forming the light entrance member and photodiode array in a predetermined positional relationship during the semiconductor manufacturing process. The positions are determined in advance through photolithography patterns and etching steps, ensuring high positioning precision before the components are assembled into the final device.

The patent extracts and removes carriers generated near the light entrance portion through dedicated carrier removal structures. These structures selectively remove excess carriers that would otherwise reach the photodiode array and create noise, while preserving the beneficial positioning and optical path restriction functions of the light entrance member.

The patent introduces intermediary structures between the light entrance member and photodiode array that act as mediators to manage carrier flow. These intermediary regions control the movement of carriers generated by incident light, preventing noise-generating carriers from reaching the photodiode elements while allowing the optical path restriction function to operate effectively.