Photodetector PCB Layout for Miniaturization and Cleaner Lens Appearance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photodetectors in vehicles face challenges in miniaturization while maintaining an aesthetically pleasing design, as the increased mounting density of electronic components on a single printed circuit board leads to a deteriorated appearance due to visible components and soldered parts being visible through the lens.
Innovation Solution
A photodetector design featuring a light receiving surface with distinct regions for visible and infrared light transmission, where only the necessary electronic components are exposed to visible light, minimizing the number of visible components and optimizing their placement to improve appearance and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are mounted on a single printed circuit board to miniaturize the photodetector, then the device size is reduced, but the mounting density increases causing electronic components and soldered parts to become visible through the lens, deteriorating the appearance design
Solution Approach 1:
The printed circuit board is divided into two distinct regions: a first region with a lower mounting density for electronic components visible through the lens, and a second region with a higher mounting density for components not visible through the lens. This segmentation allows the photodetector to maintain miniaturization while improving appearance design by strategically placing components in less visible areas.
2Adaptability or versatility
If the number of electronic components is increased on the printed circuit board to maintain functionality, then the detection capability is improved, but the mounting density increases causing more components to become visible through the lens
Solution Approach 1:
Different regions of the printed circuit board are assigned different mounting densities based on their visibility characteristics. The first region (visible through lens) has lower component density while the second region (not visible through lens) has higher component density. This local quality differentiation allows multiple electronic components to be mounted for enhanced detection capability without compromising appearance design.
3Reliability
If electronic components are arranged to optimize functionality, then the detection performance is improved, but the components are disposed directly under the lens causing visibility through the light transmitting portion
Solution Approach 1:
The printed circuit board is segmented into visible and non-visible regions, allowing electronic components to be optimally arranged for detection performance in the non-visible second region, while maintaining a clean appearance in the visible first region where fewer components are mounted.
Solution Approach 2:
The problem is solved by utilizing the spatial dimension of the printed circuit board, dividing it into different regions (first and second regions) with different mounting densities. This dimensional approach allows simultaneous optimization of both detection performance and appearance design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a compact photodetector that maintains functionality while enhancing the appearance design by reducing the number of visible electronic components, ensuring a sleeker appearance without compromising performance.
Implementation Method 1
a first light receiving element configured to detect visible light, wherein the first light receiving element is disposed at a first position of the printed circuit board, the first position being exposed to the visible light transmitted through the first region
Implementation Method 2
the photodetector includes: a case including a light receiving surface provided on an upper surface, the light receiving surface having a first region that transmits visible light and a second region that transmits less visible light than the first region; a printed circuit board provided to face the light receiving surface; and a plurality of electronic components provided on a light receiving surface side of the printed circuit board
Data Source
AI summary
A photodetector including: a case including a light receiving surface provided on an upper surface and having a first region that transmits visible light and a second region that transmits less visible light than the first region; a printed circuit board provided to face the light receiving surface; and a plurality of electronic components provided on a light receiving surface side of the printed circuit board and including a first light receiving element configured to detect visible light. The first light receiving element is disposed at a first position of the printed circuit board exposed to the visible light transmitted through the first region. The number of mounted electronic components disposed at the first position is smaller than the number of mounted electronic components disposed at a second position of the printed circuit board other than the first position.