Photodiode Array Passive Layer Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional photodiode arrays in imaging systems are complex, costly, and suffer from reliability and yield issues due to the high number of components and layers, leading to mismatched thermal expansion and poor alignment.
Innovation Solution
A simplified photodiode array design featuring a semiconductor layer coupled to a passive layer with a signal receiving component, reducing the number of components and facilitating a thinner semiconductor layer for improved performance and integration, including a redistribution layer for analog signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple stacked optoelectronic and electronic components are used in conventional photodiode arrays, then the detector can perform imaging functions, but the device complexity increases and reliability decreases due to mismatched thermal expansion and poor alignment
Solution Approach 1:
The patent merges multiple separate components (semiconductor layer, passive layer, signal receiving component) into a single integrated photodiode array structure. The passive layer is directly coupled to the semiconductor layer, eliminating the need for separate mounting structures and intervening layers, thereby reducing device complexity while maintaining reliability through direct integration.
Solution Approach 2:
The passive layer serves multiple functions simultaneously: it provides mechanical support, electrical connection, and thermal management for the semiconductor layer. This multi-functionality reduces the need for separate dedicated components, simplifying the overall structure while ensuring reliable operation under various conditions.
2Adaptability or versatility
If the number of components or layers is increased, then more functions can be integrated, but manufacturing precision decreases due to mismatched rates of thermal expansion between components
Solution Approach 1:
The patent employs a homogeneous material composition within the passive layer and semiconductor layer, both being primarily silicon-based materials. This material homogeneity ensures matched thermal expansion coefficients, preventing misalignment during temperature variations and simplifying manufacturing precision requirements while maintaining integration capability.
3Speed
If a thinner semiconductor layer is used, then temporal response and thermal characteristics improve, but manufacturing becomes more challenging
Solution Approach 1:
The passive layer acts as an intermediary between the thin semiconductor layer and the signal receiving component. It provides mechanical support and stress distribution that protects the delicate thin semiconductor layer during manufacturing and operation, enabling the use of thinner layers for improved temporal response without compromising ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design results in a more compact, cost-effective, and reliable photodiode array with improved temporal response, thermal characteristics, reduced performance variation, and less edge pixel leakage compared to conventional arrays.
Implementation Method 1
a semiconductor layer configured to convert photons into analog electrical signals
Data Source
AI summary
Embodiments of a photodiode array are provided herein. In some embodiments, a photodiode array may include a semiconductor layer configured to convert photons into analog electrical signals; and a passive layer having a first surface and a second surface disposed opposite the first surface, wherein the semiconductor layer is coupled to the first surface, and wherein the passive layer is configured to have a signal receiving component coupled directly to the second surface of the passive layer.