Photodiode Signal Routing Through-Substrate Bondwire Layout
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Solution Overview
Problem
High-resolution computed tomography (CT) systems face challenges in efficiently routing photodiode array signals to accompanying circuitry without increasing cost, size, or susceptibility to electromagnetic interference, especially with multiple rows of photodiodes requiring new approaches beyond traditional methods like dual-layer flexible chip on film (COF) or printed circuit boards (PCB).
Innovation Solution
Employing a single-layer flexible chip on film (COF) and redistribution layers (RDL) coupled with bondwires to connect photodiode arrays to circuitry, along with shields to mitigate electromagnetic interference, reducing complexity and cost while maintaining proximity and shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional dual-layer flexible COF or PCB methods are used to route photodiode array signals, then signal routing is achieved, but cost and device complexity increase
Solution Approach 1:
The patent divides the routing structure into two separate single-layer COFs, each handling different signal types (analog signals on one COF, digital signals on another COF). This segmentation simplifies each individual layer while achieving complete signal routing functionality, reducing overall manufacturing cost and complexity compared to traditional dual-layer approaches
Solution Approach 2:
The patent introduces bondwires as intermediary elements to connect photodiode arrays to the flexible COF structure. These bondwires serve as simple, low-cost connectors that eliminate the need for complex integrated routing structures, thereby reducing device complexity and manufacturing cost
2Volume of moving object
If photodiode arrays and circuitry are integrated closely to reduce size, then compact integration is achieved, but susceptibility to electromagnetic interference increases
Solution Approach 1:
The patent segments the signal routing into separate analog and digital pathways on different flexible COFs, physically separating sensitive analog photodiode signals from potentially interfering digital circuitry. This spatial segmentation maintains compact integration while reducing electromagnetic interference susceptibility through functional isolation
Solution Approach 2:
The patent applies different structural qualities to different regions: the flexible COF provides a lightweight, compact substrate for photodiode mounting, while strategic placement of shields provides localized electromagnetic protection only where needed, optimizing the balance between compactness and interference protection
3Object-affected harmful factors
If shields are added to mitigate electromagnetic interference, then electromagnetic interference is reduced, but device complexity and size increase
Solution Approach 1:
The patent implements shields selectively only in regions where electromagnetic interference protection is most critical, rather than providing comprehensive shielding throughout the entire structure. This localized approach reduces electromagnetic interference where needed while minimizing the addition of complexity and size
Solution Approach 2:
The patent uses flexible COF (chip on film) structures as lightweight, thin-film substrates that provide structural support and signal routing without the bulk and rigidity of traditional PCBs. These flexible films enable compact integration while allowing strategic placement of thin shields that add minimal complexity and size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes cost, size, and electromagnetic interference, enabling high-resolution CT imaging by efficiently routing photodiode signals and maintaining compact, shielded integration of photodiode arrays and circuitry.
Implementation Method 1
The first semiconductor die and the second semiconductor die are coupled to one another through an opening in the substrate by a bondwire
Implementation Method 2
converting the electromagnetic radiation signal to light
Data Source
AI summary
The present disclosure generally relates to an electronic system for sensing electromagnetic radiation. In an example, an electronic system includes a substrate having a first surface and a second surface, the second surface is opposite the first surface. The electronic system also includes a first semiconductor die on the first surface of the substrate, and a second semiconductor die on the second surface of the substrate. The first semiconductor die and the second semiconductor die are coupled to one another through an opening in the substrate by a bondwire.