Semiconductor Photo Diode Layout to Avoid Light Interference
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Solution Overview
Problem
Conventional electronic devices with integrated sensing modules require additional fabrication of optical structures, increasing manufacturing complexity and procedures.
Innovation Solution
An electronic device design that includes a semiconductor substrate with transistors and photo diodes, where a light emitting module with non-overlapping light emitting elements is disposed on the substrate, eliminating the need for additional optical structures and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional optical structures are fabricated for the sensing module, then the sensing function can be provided, but the manufacturing procedure becomes more complex
Solution Approach 1:
The patent integrates the optical structure directly into the semiconductor substrate by forming the photo diode within the substrate itself, merging the sensing function with the existing substrate structure. This eliminates the need for separate optical components and reduces manufacturing complexity while maintaining sensing reliability
Solution Approach 2:
The semiconductor substrate serves multiple functions: it acts as both the structural base for transistors and as the optical sensing element through the integrated photo diode. This multi-functionality reduces the need for additional specialized optical structures and simplifies the overall manufacturing process
2Area of stationary object
If light emitting elements overlap with photo diodes, then compact design is achieved, but light interference occurs
Solution Approach 1:
The patent resolves the spatial conflict between light emitting elements and photo diodes by utilizing vertical layering. The light emitting module is positioned above the semiconductor substrate at a height that prevents overlap with the photo diode, effectively using the vertical dimension to avoid light interference while maintaining a compact overall device footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing procedure by integrating photo diodes within the semiconductor substrate and using a light emitting module that does not overlap with photo diodes, reducing the probability of light interference and allowing for efficient identity recognition functions like fingerprint sensing without the need for additional optical structures.
Implementation Method 1
The semiconductor substrate includes multiple transistors and multiple photo diodes
Implementation Method 2
The light emitting module is disposed on the semiconductor substrate and includes multiple light emitting elements
Data Source
AI summary
An electronic device and a method of manufacturing the electronic device are provided. The electronic device includes a semiconductor substrate and a light emitting module. The semiconductor substrate includes multiple transistors and multiple photo diodes. The light emitting module is disposed on the semiconductor substrate and includes multiple light emitting elements. The light emitting elements are respectively electrically connected to the transistors, and the light emitting elements do not overlap with the photo diodes.