Photodiode Sub-mount Wavelength Alignment for Laser Module Stability

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Solution Overview

Problem

The fluctuation of light-receiving sensitivity of photodiodes due to temperature and emission wavelength changes in light-emitting elements is not effectively addressed in existing technologies, leading to inconsistent performance in laser modules.

Innovation Solution

A sub-mount with a built-in photodiode is designed, featuring a semiconductor structure with a specific conductivity-type layer configuration, including a first conductivity-type layer and a second conductivity-type region, optimized to receive light within a specific wavelength range (790 nm to 845 nm) and maintain a depletion layer thickness of 20 μm to 45 μm, ensuring peak light-receiving wavelength alignment with the emission wavelength of the light-emitting element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional photodiode structure is used, then the device complexity is low, but the light-receiving sensitivity fluctuates significantly with temperature and emission wavelength changes

Engineering Contradiction:
Improvelight-receiving sensitivity stabilityVSAvoidphotodiode structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by optimizing the depletion layer thickness to a specific range (20-45 μm) and configuring the conductivity-type layer structure (p-type layer depth of 1-5 μm) to reduce the fluctuation of light-receiving sensitivity. These parameter adjustments enable the photodiode to maintain stable performance across temperature and wavelength variations without adding complex external control systems.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements local quality by creating a specifically structured photodiode region with differentiated conductivity-type layers within the sub-mount. The p-type layer is positioned at a specific depth (1-5 μm) from the light-receiving surface, and the depletion layer is configured with controlled thickness (20-45 μm), giving different regions of the photodiode structure distinct functional properties that collectively improve sensitivity stability.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If the depletion layer thickness is increased to improve light absorption, then the light-receiving sensitivity increases, but the manufacturing precision requirements become more stringent

Engineering Contradiction:
Improvelight-receiving sensitivityVSAvoiddepletion layer thickness control
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent specifies a depletion layer thickness range of 20-45 μm, which balances light absorption efficiency with manufacturability. This parameter range is optimized to achieve sufficient light-receiving sensitivity while remaining feasible for standard semiconductor manufacturing processes, avoiding excessively tight tolerance requirements.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a depletion layer thickness that is sufficiently large (20-45 μm) to ensure adequate light absorption and sensitivity, but not excessively large to the point where manufacturing becomes prohibitively difficult. This partial action approach achieves the necessary performance threshold without over-engineering the depletion layer thickness.

Inventive Principle:
Principle #16Partial or excessive action

3Measurement precision

If the photodiode is designed for high sensitivity at a specific wavelength, then the measurement precision at that wavelength improves, but the adaptability to wavelength variations deteriorates

Engineering Contradiction:
Improvephotocurrent detection accuracyVSAvoidwavelength range coverage
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The patent optimizes the photodiode structure parameters (depletion layer thickness of 20-45 μm, p-type layer depth of 1-5 μm) to achieve a balance between peak sensitivity and wavelength range coverage. This parameter configuration enables the photodiode to maintain acceptable detection accuracy across the emission wavelength range of 790-845 nm while preserving reasonable adaptability to wavelength variations.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent designs the photodiode with a universal structure that can effectively detect light across a wavelength range (790-845 nm) rather than being optimized for a single wavelength. The configured depletion layer and conductivity-type layer structure provide multi-functional capability, allowing the photodiode to serve as a reliable detector for various emission wavelengths within the specified range.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the fluctuation range of light-receiving sensitivity, maintaining consistent photocurrent generation even with temperature and emission wavelength variations, thereby enhancing the stability and accuracy of light-emitting element modules.

Implementation Method 1

a photodiode having a first conductivity-type layer arranged in a surface portion in the sub-mount of the photodiode region to form a light-receiving surface, and a second conductivity-type region arranged below the first conductivity-type layer. The photodiode is configured to receive at the light-receiving surface a light emitted from a light-emitting element and convert the light into a photocurrent.

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 2

a depletion layer generated from the first conductivity-type layer has a thickness of 20 μm to 45 μm

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS9071032B2Sub-mount having photodiode and light-emitting element module
Publication Date: 2015.06.30 ROHM CO LTD
  • US9071032B2 patent drawing
  • US9071032B2 patent drawing
  • US9071032B2 patent drawing

AI summary

A sub-mount having a photodiode region, includes a photodiode which has a first conductivity-type layer arranged in a surface portion of the sub-mount of the photodiode region to form a light-receiving surface and a second conductivity-type region arranged below the first conductivity-type layer and is configured to receive at the light-receiving surface a light emitted from a light-emitting element and convert the light into a photocurrent. A peak light-receiving wavelength at which the photocurrent of the photodiode becomes its maximum value is more than or equal to a minimum emission wavelength of the light-emitting element and less than or equal to a maximum emission wavelength of the light-emitting element.