Photoelectric Conversion Device Connection Conductor Segmentation
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Solution Overview
Problem
The brittleness of the chalcogen compound semiconductor layer in photoelectric conversion devices leads to peeling issues during groove processing, causing connection failures between the connection conductor and the lower electrode, which deteriorates the photoelectric conversion efficiency.
Innovation Solution
A photoelectric conversion device design featuring a substrate with lower electrodes, photoelectric conversion layers, and a connection conductor with a first and second connection portion, where the first connection portion is connected to the lower electrode through a first metal-chalcogen compound layer, and the second connection portion is directly connected without this layer, enhancing adhesion and reducing peeling risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chalcogen compound semiconductor layer is used as a light-absorbing layer, then photoelectric conversion function is achieved, but the layer is brittle and peeling occurs during groove processing
Solution Approach 1:
The connection conductor is divided into two distinct connection portions: a first connection portion that contacts the lower electrode through the metal-chalcogen compound layer, and a second connection portion that directly contacts the lower electrode. This segmentation allows each portion to serve different functions - one providing electrical connection through the semiconductor layer and the other providing mechanical anchoring directly to the electrode, thereby preventing peeling while maintaining connection reliability
Solution Approach 2:
The connection conductor extends in multiple dimensions relative to the lower electrode - vertically through the grooves to contact the photoelectric conversion layers, and horizontally along the lower electrode surface. This multi-dimensional configuration provides both electrical connection pathways and mechanical anchoring points, preventing peeling during groove processing while ensuring reliable electrical connection
2Reliability
If grooves are processed to form connection conductors, then electrical connection between cells is achieved, but peeling of the light-absorbing layer occurs causing connection failure
Solution Approach 1:
The metal-chalcogen compound layer serves as an intermediary between the connection conductor and the lower electrode. The first connection portion of the connection conductor contacts this intermediate layer, which provides both electrical conductivity and mechanical bonding. This intermediary structure ensures reliable electrical connection while the direct contact portion provides mechanical stability, preventing connection failures during groove processing
3Reliability
If the connection conductor connects through the metal-chalcogen compound layer, then electrical connection is achieved, but peeling risk increases during processing
Solution Approach 1:
The connection conductor is segmented into two functional portions: the first connection portion that provides electrical connection through the metal-chalcogen compound layer, and the second connection portion that provides mechanical anchoring by directly contacting the lower electrode. This segmentation distributes the functional requirements, reducing peeling risk while maintaining electrical connection reliability
Solution Approach 2:
Different portions of the connection conductor have different connection qualities - the first connection portion is optimized for electrical conduction through the semiconductor layer, while the second connection portion is optimized for mechanical bonding directly to the electrode. This local differentiation of connection quality reduces peeling risk during processing while ensuring reliable electrical connection where needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures a reliable connection between the connection conductor and the lower electrode, thereby improving the photoelectric conversion efficiency by preventing peeling and ensuring stable electrical connections between neighboring cells.
Implementation Method 1
the first connection portion is connected to the lower electrode through a first metal-chalcogen compound layer comprising the metal element and a chalcogen element included in the chalcogen compound semiconductor
Implementation Method 2
A chalcopyrite-based photoelectric conversion device, as typified by a CIS type (copper indium selenide type), easily allows an increase in the area of a solar cell module with a relatively low cost
Data Source
AI summary
To provide a photoelectric conversion device having a high photoelectric conversion efficiency, a photoelectric conversion device 21 includes a substrate 1, a plurality of lower electrodes 2 on the substrate 1 comprising a metal element, a plurality of photoelectric conversion layers 33 comprising a chalcogen compound semiconductor formed on the plurality of lower electrodes 2 and separated from one another on the lower electrodes 2, a metal-chalcogen compound layer 8 comprising the metal element and a chalcogen element included in the chalcogen compound semiconductor formed between the lower electrode 2 and the photoelectric conversion layer 33, an upper electrode 5 formed on the photoelectric conversion layer 33, and a connection conductor 7 electrically connecting, in a plurality of the photoelectric conversion layers 33, the upper electrode 5 to the lower electrode 2 without interposition of the metal-chalcogen compound layer 8.