Photoelectric Sensor Housing Segmentation to Control Plastic Shrinkage
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Solution Overview
Problem
Existing photoelectric sensors manufactured as single units face issues with the U-shaped housing tilting inward due to uneven plastic material shrinkage during injection molding, affecting appearance and bonding strength.
Innovation Solution
The photoelectric sensor design includes a housing with concave structures and adhesive members to embed the light-emitting and light-receiving modules, along with reinforcing ribs and grooves to manage plastic shrinkage and improve bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photoelectric sensors are manufactured as a single unit, then manufacturing time is shortened and costs are reduced, but the U-shaped housing tilts inward due to uneven shrinkage of plastic material
Solution Approach 1:
The housing is divided into multiple independent components: a U-shaped housing and two separate side pieces. The side pieces are individually molded and then assembled to the U-shaped housing. This segmentation allows each component to be manufactured separately with controlled shrinkage, preventing the inward tilting problem that occurs when manufacturing the entire housing as a single unit.
2Device complexity
If the U-shaped housing is manufactured as a single unit, then manufacturing complexity is reduced, but the bonding strength between the circuit board and the housing decreases due to housing tilt
Solution Approach 1:
The housing structure is segmented into a U-shaped housing and separate side pieces. This segmentation enables precise control of each component's geometry during molding, ensuring that the mounting surfaces remain perpendicular to the base. As a result, the circuit board can be bonded with maximum strength without the compromise caused by housing tilt.
Solution Approach 2:
The side pieces are pre-formed with precise geometric dimensions and perpendicular mounting surfaces before assembly to the U-shaped housing. This preliminary action ensures that when the circuit board is subsequently bonded to the assembled housing, the bonding surface is already optimized for maximum bonding strength, eliminating the need for post-assembly adjustments.
Data Source
AI summary
A photoelectric sensor includes a housing, a light-emitting module, a light-receiving module, and two adhesive members. The housing including a first upright portion, a second upright portion, and a base portion. The first upright portion has a first concave structure and a first opening. The first concave structure includes a first side wall and a first outer wall. The second upright portion has a second concave structure and a second opening. The second concave structure includes a second side wall and a second outer wall. The light-emitting module is embedded in the first concave structure. The light-emitting module and the light-receiving module are embedded in the second concave structure through the two adhesive members, respectively. The light-emitting module includes a light-emitting element, and the light-receiving module includes a light-receiving element. The light-emitting element corresponds to the first opening, and the light-receiving element corresponds to the second opening.