Photoelectric Conversion Device Side Electrical Connection Narrow Bezel

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Solution Overview

Problem

Existing photoelectric conversion devices face challenges in achieving stable electrical connections and effective sealing, particularly in sheet-emitting organic EL illumination panels and organic thin-film solar cells, due to insufficient contact areas and interactions between conductive microspheres and insulative resins, leading to unstable connections and compromised sealing performance.

Innovation Solution

A photoelectric conversion device design featuring a substrate with a photoelectric conversion element and a sealing member, where a bonding member outside the organic compound layer ensures sealing, and a side conductive portion with a protrusion establishes electrical connection, allowing for a stable and narrow bezel structure with reduced joint visibility when devices are adjacent.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through-holes are provided in the transparent substrate for electrical connection, then electrical connection is achieved, but the luminous area cannot be enlarged

Engineering Contradiction:
Improveelectrical connectionVSAvoidluminous area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from planar electrical connection (through-holes in substrate) to three-dimensional connection by extending the electrode from the backside of the sealing plate through the thickness direction to the side face, allowing electrical connection without occupying luminous area on the front surface

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If multiple bonding portions are used for sealing (between substrate and metal frame, and between metal frame and protection cover), then sealing is achieved, but insufficient bonding occurs resulting in compromised sealing performance

Engineering Contradiction:
Improvesealing performanceVSAvoidnumber of bonding portions
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the metal frame and multiple bonding interfaces from the sealing structure, replacing them with a direct bonding between the transparent substrate and sealing plate, eliminating the intermediate components that caused bonding insufficiency

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the sealing function into a single bonding interface between the transparent substrate and sealing plate, consolidating multiple separate bonding portions into one unified sealing structure that ensures sufficient bonding

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If electric connection terminals are exposed in a direction parallel to the surface of the transparent substrate, then electrical connection is achieved, but adjacent devices cannot be disposed with narrow gaps due to terminal interference

Engineering Contradiction:
Improveelectrical connectionVSAvoidadjacent device disposal
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent relocates the electrical connection from the parallel surface direction to the thickness direction by extending the electrode through the sealing plate to the side face, allowing adjacent devices to be disposed with narrow gaps without terminal interference

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8742526B2Photoelectric conversion device
Publication Date: 2014.06.03 IDEMITSU KOSAN CO LTD
  • US8742526B2 patent drawing
  • US8742526B2 patent drawing
  • US8742526B2 patent drawing

AI summary

A photoelectric conversion device including a substrate, a photoelectric conversion element including a first electrode, a second electrode and an organic compound layer and a sealing member that are disposed in this order. When a cross section of the photoelectric conversion device in a thickness direction is observed with the sealing member being placed at an upper side, a bonding member seals the organic compound layer at an outside thereof. An output electrode on the sealing member has a protrusion. A side conductive portion is electrically connected with the protrusion in an up-and-down direction. A substrate conductive member electrically connected with the first electrode and the second electrode extends to an outside of the bonding member. An electrical connecting member electrically connects the side conductive portion to the substrate conductive member at a further outside of the bonding member.