Photoelectric Signal Conversion Device Miniaturization
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Solution Overview
Problem
Existing photoelectric signal conversion and transmission devices face signal attenuation and miniaturization challenges due to the extended wiring distance between amplifiers and photoelectric elements, with amplifiers located on the circuit main board increasing the device's size.
Innovation Solution
Placing light emission or reception elements and amplifiers on the same connection base, configured perpendicularly on the circuit board, reduces the wiring distance and allows the amplifier to be positioned between the circuit board and elements, enhancing signal quality and facilitating miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the amplifier is located on the circuit main board separately from the photoelectric elements, then the device structure is simplified, but the wiring distance increases leading to signal attenuation and lower signal quality
Solution Approach 1:
The amplifier and photoelectric elements are merged onto the same connection base, eliminating separate wiring connections and reducing signal attenuation. This combining approach maintains structural simplicity while improving signal quality by placing components in close proximity.
Solution Approach 2:
The connection base serves as an intermediary platform that hosts both the photoelectric elements and amplifier in close proximity. This intermediary structure enables short-distance internal wiring while maintaining modularity and ease of assembly.
2Ease of manufacture
If the amplifier is located on the circuit main board, then the device has sufficient space for component placement, but the circuit board requires additional dimension making miniaturization difficult
Solution Approach 1:
By merging the amplifier and photoelectric elements on the same connection base, the circuit board area requirement is reduced. The integrated arrangement eliminates the need for separate amplifier mounting space on the main circuit board, enabling device miniaturization.
Solution Approach 2:
The connection base provides a vertical dimension for component arrangement, allowing the amplifier and photoelectric elements to be positioned in three-dimensional space rather than constrained to a two-dimensional circuit board layout. This enables more compact overall device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces signal attenuation and enhances transmission performance while allowing for the miniaturization of the photoelectric signal conversion and transmission device by minimizing the circuit board's dimensions.
Implementation Method 1
Photoelectric elements are disposed on a face of the connection base facing the fiber joint
Data Source
AI summary
The photoelectric signal conversion and transmission device includes a photoelectric signal module and a fiber joint, matched and coupled together. A circuit board of the photoelectric signal module includes one or more connection bases. Light emission elements, light reception elements, and amplifiers are configured on a first coupling face of the connection based, and electrically connected by first and second wires. The fiber joint includes a number of fibers axially aligned with the light emission and reception elements. By having the light emission and reception elements and amplifiers configured on a same coupling face, their physical connection distance is reduced, thereby decreasing signal attenuation, enhancing signal transmission performance, and facilitating structural miniaturization.