Photoelectric Wiring Module Horizontal Alignment
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Solution Overview
Problem
Conventional photoelectric wiring modules face challenges such as miniaturization limitations, optical focusing issues, complex manufacturing processes, unstable component mounting, and low productivity due to vertical alignment structures and the use of metal ground plates, which hinder high-speed data transmission and reliability.
Innovation Solution
A photoelectric wiring module with a horizontal alignment structure for butt-coupling and passive alignment, using a substrate with a frame-mounted optical device package and optical control device, eliminating the need for additional processing and enabling close optical coupling without lenses or mirrors, and utilizing a PCB substrate for component mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a vertical alignment structure with 45° mirror surface is used for optical coupling, then optical signal transmission is achieved, but optical loss increases and coupling distance becomes large
Solution Approach 1:
The patent inverts the conventional vertical alignment structure with 45° mirror to a horizontal alignment structure with 0° mirror surface. The VCSEL chip emits light horizontally along the substrate surface, and the optical waveguide is positioned horizontally to receive the light directly, eliminating the need for 45° reflection and reducing optical loss while minimizing coupling distance.
Solution Approach 2:
The patent removes the 45° mirror surface from the optical waveguide end tip, which was causing optical loss and increasing coupling distance in conventional designs. By extracting this unnecessary reflective element and implementing direct horizontal light coupling, the design achieves lower optical loss and shorter coupling distance.
2Ease of manufacture
If a metal ground plate is used for mounting optical components, then electrical connection is provided, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the ground plate function with a standard PCB substrate. The PCB provides both the mechanical mounting surface for optical components and the electrical grounding path, eliminating the need for a separate metal ground plate and simplifying the manufacturing process while reducing structural complexity.
Solution Approach 2:
The PCB substrate serves multiple functions simultaneously: it acts as the mechanical base for mounting the VCSEL chip and optical waveguide, provides electrical grounding through its ground layers, and enables signal routing. This multi-functional approach replaces the conventional separate metal ground plate structure.
3Reliability
If passive alignment with horizontal structure is used for butt-coupling, then optical coupling reliability improves and miniaturization is enabled, but precise alignment precision is required
Solution Approach 1:
The patent implements passive alignment where the horizontal structures of the VCSEL chip package and optical waveguide automatically align through their geometric features during assembly. The aligned horizontal interfaces enable butt-coupling without requiring active alignment adjustments, achieving reliable optical coupling while simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates mass production, ensures optical coupling reliability, promotes miniaturization, and enhances electrical connection reliability, allowing for high-speed data transmission between boards while simplifying the manufacturing process.
Implementation Method 1
an electric signal (i.e., image data) of a mainboard connected to the transmitter is converted into an optical signal by the VCSEL chip 3a
Implementation Method 2
The optical signal is vertically emitted from the VCSEL chip 3a in an upward direction, reflected by a 45° mirror surface of an end tip of the optical waveguide 2
Implementation Method 3
The optical signal is converted into an electric signal by the PD chip 3b
Data Source
AI summary
Disclosed is a photoelectric wiring module which includes: a substrate; a frame mounted on the substrate; an optical device package configured to perform photoelectric conversion or electro-optic conversion of a signal; an optical control device configured to control an operation of the optical device package; and an optical transmission line configured to transmit an optical signal that is emitted from the optical device package or incident on the optical device package. Electrical terminals are disposed on the frame, the optical device package is mounted on the frame, and the optical control device is disposed within the frame and mounted on the substrate.