Photoimagable Dielectric IC Packaging for Height Reduction
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Solution Overview
Problem
Modern electronics require integrated circuit packaging systems that offer lower cost, smaller size, and increased functionality while minimizing physical space, but existing technologies have not adequately addressed these needs for reduced height, simplified manufacturing, and cost reduction.
Innovation Solution
The development of an integrated circuit packaging system that includes a photoimagable dielectric layer with a trace opening, an inner solder resist layer, and an external interconnect, where the trace is formed within the dielectric layer to reduce height and simplify manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional packaging methods are used, then manufacturing processes are well-established, but package height and physical space are not reduced
Solution Approach 1:
The patent implements a stacked three-dimensional packaging architecture where multiple integrated circuit chips are vertically arranged and interconnected through through-silicon vias (TSVs). This vertical stacking approach reduces the horizontal footprint while maintaining functionality, directly addressing the contradiction between reducing package height/space and maintaining ease of manufacture through established processes.
Solution Approach 2:
The patent embeds multiple functional layers within the package structure, including TSVs nested within chips, interconnect structures nested between layers, and encapsulation materials nested around components. This nesting approach maximizes space utilization and reduces overall package dimensions while using conventional manufacturing techniques.
2Volume of moving object
If package dimensions are reduced, then space efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent divides the integrated circuit package into discrete modular layers and components, each manufactured separately using standard processes, then assembled through precise alignment and interconnection structures. This segmentation enables compact packaging while maintaining manufacturing simplicity through modularity and reuse of existing fabrication capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of higher-density packages with improved yield and manufacturing efficiency, reducing warpage and complexity while maintaining electrical performance.
Implementation Method 1
forming a photoimagable dielectric layer on the carrier, the photoimagable dielectric layer having a trace opening for exposing the carrier
Data Source
AI summary
A system and method of manufacture of an integrated circuit packaging system includes: a photoimagable dielectric layer having a trace opening for exposing the carrier; a trace within the trace opening; an inner solder resist layer directly on the photoimagable dielectric layer and the trace, the inner solder resist layer having a bond pad opening for exposing the trace; an integrated circuit over the inner solder resist layer, the integrated circuit electrically connected to the trace through the bond pad opening; an encapsulation directly on the integrated circuit and the inner solder resist layer; and an external interconnect electrically coupled to the trace and the integrated circuit.