Photoimageable Dielectric Mask for IC Substrate Hole Precision
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Solution Overview
Problem
Integrated circuit substrates face challenges in accurately connecting electronic components due to limitations in manufacturing processes and material properties, particularly in the precision of hole openings and conductive layer deposition.
Innovation Solution
The use of a photoimageable dielectric material as a permanent mask layer within the substrate, allowing for precise control of hole openings and enabling the deposition of patterned conductive layers on both sides of the substrate, enhancing connectivity and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional dielectric materials are used in integrated circuit substrates, then manufacturing process is simpler, but hole-opening accuracy and conductive layer deposition precision deteriorate
Solution Approach 1:
The patent introduces a photoimageable dielectric material as an intermediary substance that enables precise hole-opening and conductive layer deposition. This material acts as a mediator between the manufacturing process and the final substrate structure, allowing for controlled patterning through light exposure and development processes, thereby achieving high precision without overly complicating the overall manufacturing workflow
Solution Approach 2:
The patent replaces conventional mechanical drilling or punching methods for creating holes with a photochemical process. By using light to expose and develop the photoimageable dielectric material, precise hole openings are achieved without mechanical contact, eliminating the limitations and inaccuracies associated with mechanical systems while maintaining process simplicity
2Manufacturing precision
If photoimageable dielectric material is used as permanent mask layer, then hole-opening accuracy and conductive layer deposition precision improve, but manufacturing process complexity increases
Solution Approach 1:
The patent combines multiple functions into the photoimageable dielectric material itself. It serves simultaneously as the dielectric layer, the mask layer for hole-opening, and the mask layer for conductive layer deposition. This merging of functions eliminates the need for separate mask layers and reduces the overall number of manufacturing steps, thereby improving precision without proportionally increasing process complexity
Solution Approach 2:
The photoimageable dielectric material is designed with multi-functionality, serving as both the insulating dielectric medium and the patterning mask. This universal material performs multiple roles in the manufacturing process - providing electrical insulation, enabling precise hole formation through photolithography, and guiding conductive layer deposition - thereby reducing the need for additional specialized components or process steps
3Weight of moving object
If substrate thickness is reduced to achieve thin structure, then substrate weight and material usage decrease, but structural strength and self-support capability deteriorate
Solution Approach 1:
The patent employs composite material construction within the substrate layers. The photoimageable dielectric material is combined with conductive layers and other functional layers to create a composite structure. This composite approach allows the substrate to maintain reduced thickness and weight while the layered composite architecture provides enhanced mechanical strength and self-support capability that a single homogeneous material of the same thickness would not achieve
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the accuracy of hole-opening and connectivity between electronic components, providing a thin yet strong substrate structure that supports reliable connections to printed circuit boards.
Implementation Method 1
photoimageable dielectric material that is retained in the integrated circuit substrate
Data Source
AI summary
An integrated circuit substrate, and method of production, includes an internal patterned mask layer defined by multiple mask units that are spaced apart by gaps on a partially or completely removable carrier, and an internal conductive trace layer formed by one or more internal conductive traces that are deposited into the gaps of each internal patterned mask layer such that each gap is occupied with an internal conductive trace. The internal patterned mask layer is made of a photoimageable dielectric material that is retained in the integrated circuit substrate. Other embodiments include the formation of permanent or removable external patterned mask layer and external conductive trace layer on the topmost and optionally the bottommost internal patterned mask layer and internal conductive trace layer. The substrate can also include an insulating layer to partially or completely encapsulate the external conductive trace layer upon removal of the external patterned mask layer.