Photoimageable Polymer Composition for Microelectronic Patterning

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Solution Overview

Problem

Current organic photosensitive compositions used in microelectronics and optoelectronics lack improved patterning properties, particularly in applications like redistribution layers (RDL) and CMOS, where polymer reflow during high-temperature curing compromises pattern integrity, adhesion, chemical resistance, and mechanical properties.

Innovation Solution

A photoimageable solvent-developable negative tone composition is developed, comprising a polymer with specific repeating units, a photobase generator, and a carrier solvent, which enhances imageability, maintains pattern integrity after curing, improves bond adhesion, and reduces solvent swelling, thereby addressing the limitations of existing compositions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional organic photosensitive compositions are used, then the material can be processed, but pattern integrity deteriorates due to polymer reflow during high-temperature curing

Engineering Contradiction:
Improvepattern integrityVSAvoidpolymer reflow during curing
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The patent introduces specific polymer repeating units with particular chemical structures (formula IA) that have controlled glass transition temperatures and thermal stability. By changing the chemical composition parameters of the polymer, the material maintains pattern integrity at high curing temperatures while remaining processable at lower temperatures.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite photoimageable composition combining the specific polynorbornene polymer with photobase generators and carrier solvents. This composite material integrates multiple functional components that work together to provide both processability and thermal stability, preventing polymer reflow during curing.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If conventional photosensitive compositions are used, then basic processing is possible, but imageability is insufficient for high-resolution patterning

Engineering Contradiction:
ImproveimageabilityVSAvoidcomposition complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent incorporates specific functional groups (formulae A, B, and C) at particular positions within the polymer repeating units. These localized structural features provide enhanced imageability and photosensitivity at specific sites without requiring complete redesign of the entire composition system.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves improved imageability, pattern integrity, bond adhesion, and chemical resistance, enabling high-resolution images and reliable bonding in microelectronic and optoelectronic devices, particularly in CMOS and RDL applications, with enhanced mechanical properties and reduced pattern reflow.

Implementation Method 1

exposure to an effective actinic radiation generates a base which initiates a crosslinking reaction

Methodology Applied
Scientific EffectPhotodissociation: Photodissociation

Data Source

PatentUS9823565B2Photoimageable compositions containing photobase generators
Publication Date: 2017.11.21 SUMITOMO BAKELITE CO LTD
  • US9823565B2 patent drawing
  • US9823565B2 patent drawing
  • US9823565B2 patent drawing

AI summary

Embodiments in accordance with the present invention encompass negative-tone, solvent developable, self-imageable polymer compositions containing photobase generators which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays.