Photolithography Light-Emitting Layers for High-Resolution Displays
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Solution Overview
Problem
Current display apparatus manufacturing methods face challenges in achieving high-resolution, high-definition, and highly reliable displays with high luminance, particularly due to issues with light-emitting layer formation accuracy and reliability, especially when using metal masks which can result in low yield and reduced aperture ratio.
Innovation Solution
The use of a photolithography method without a shadow mask to form island-shaped light-emitting layers for each pixel electrode, combined with a color conversion layer and specific insulating layers to enhance light emission efficiency and reliability, and the strategic placement of functional layers to reduce damage and leakage currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal masks are used to form light-emitting layers, then manufacturing process is simplified, but manufacturing precision and reliability deteriorate due to low yield and reduced aperture ratio
Solution Approach 1:
The invention extracts and removes the metal mask from the manufacturing process entirely. Instead of using metal masks to form light-emitting layers, the patent employs a photolithography method where a light-sensitive resin layer is patterned using photomasks, and the light-emitting layer is subsequently formed only in the exposed regions. This extraction of the metal mask eliminates the associated precision and reliability problems while maintaining ease of manufacture through the photolithography process.
Solution Approach 2:
The invention replaces the mechanical metal mask system with a photolithographic system. Instead of physically blocking material deposition with a metal mask, the patent uses light-sensitive resin that is selectively exposed and developed to create patterns. This substitution of mechanical masking with photochemical patterning improves manufacturing precision and reliability while achieving the desired light-emitting layer formation.
2Ease of manufacture
If metal masks are used for light-emitting layer formation, then manufacturing process is easier, but manufacturing yield and reliability worsen
Solution Approach 1:
The invention extracts and removes the metal mask from the manufacturing process entirely. Instead of using metal masks to form light-emitting layers, the patent employs a photolithography method where a light-sensitive resin layer is patterned using photomasks, and the light-emitting layer is subsequently formed only in the exposed regions. This extraction of the metal mask eliminates the associated precision and reliability problems while maintaining ease of manufacture through the photolithography process.
Solution Approach 2:
The invention replaces the mechanical metal mask system with a photolithographic system. Instead of physically blocking material deposition with a metal mask, the patent uses light-sensitive resin that is selectively exposed and developed to create patterns. This substitution of mechanical masking with photochemical patterning improves manufacturing precision and reliability while achieving the desired light-emitting layer formation.
3Illumination intensity
If aperture ratio is increased for high luminance, then light emission efficiency improves, but manufacturing precision deteriorates due to metal mask limitations
Solution Approach 1:
The invention extracts and removes the metal mask from the manufacturing process entirely. Instead of using metal masks to form light-emitting layers, the patent employs a photolithography method where a light-sensitive resin layer is patterned using photomasks, and the light-emitting layer is subsequently formed only in the exposed regions. This extraction of the metal mask eliminates the associated precision and reliability problems while maintaining ease of manufacture through the photolithography process.
Solution Approach 2:
The invention replaces the mechanical metal mask system with a photolithographic system. Instead of physically blocking material deposition with a metal mask, the patent uses light-sensitive resin that is selectively exposed and developed to create patterns. This substitution of mechanical masking with photochemical patterning improves manufacturing precision and reliability while achieving the desired light-emitting layer formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of high-resolution display apparatus with improved reliability, increased aperture ratio, and enhanced manufacturing yield, allowing for efficient light emission with high luminance and color purity.
Implementation Method 1
The color conversion layer converts a color of light emitted from the first light-emitting device into a different color
Implementation Method 2
The use of a photolithography method without a shadow mask to form island-shaped light-emitting layers for each pixel electrode
Data Source
AI summary
A high-resolution display apparatus is provided. The display apparatus includes first to third light-emitting devices, a color conversion layer, and first and second insulating layers. The first light-emitting device includes a first pixel electrode, a first light-emitting layer, and a common electrode. The second light-emitting device includes a second pixel electrode, a second light-emitting layer, and the common electrode. The third light-emitting device includes a third pixel electrode, a third light-emitting layer, and the common electrode. The first and second light-emitting layers contain the same light-emitting material. The third light-emitting material emits shorter-wavelength light than the first and second light-emitting devices. The color conversion layer overlaps with the first light-emitting device. The color conversion layer converts a color of light emitted from the first light-emitting device into a different color. The first and second insulating layers each overlap with a side surface and part of a top surface of the first light-emitting layer and a side surface and part of a top surface of the second light-emitting layer. The common electrode covers a top surface of the second insulating layer.


