Photomask Auxiliary Patterns for Proximity Exposure Resolution

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Solution Overview

Problem

Conventional proximity exposure methods in lithography face challenges in forming fine patterns due to pattern distortion caused by Fresnel diffraction, limiting resolution to around 4-5 μm with a 50 μm gap, and are costly due to the need for high-accuracy lenses in projection exposure methods.

Innovation Solution

A photomask design featuring a translucent substrate with a light blocking member, including a main pattern portion and auxiliary pattern portions that transmit in-phase light to enhance light intensity at the outline of the desired pattern, allowing for improved resolution comparable to projection exposure methods without the need for high-accuracy lenses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If proximity exposure is performed with a gap between photomask and exposed body, then production cost is reduced and ease of manufacture is improved, but pattern resolution deteriorates due to Fresnel diffraction distortion

Engineering Contradiction:
Improveease of manufactureVSAvoidpattern resolution
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-calculating and correcting the pattern design data before photomask fabrication. The correction process anticipates the Fresnel diffraction distortion that will occur during proximity exposure and compensates for it in advance. This allows the use of simple proximity exposure equipment without high-accuracy lenses while still achieving the desired pattern resolution on the exposed body.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the parameters of the pattern design data, specifically adjusting line widths, spacing, and other geometric parameters to compensate for the expected diffraction effects. By modifying these parameters beforehand, the distortion caused by the gap-induced Fresnel diffraction is counteracted, enabling high-resolution pattern formation through low-cost proximity exposure.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If projection exposure method is used with high-accuracy lens, then pattern resolution is improved to wavelength level, but equipment cost increases substantially

Engineering Contradiction:
Improvepattern resolutionVSAvoidequipment cost
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts and removes the need for high-accuracy projection lenses from the exposure system. By taking out this expensive optical component and replacing it with simple proximity exposure equipment, the patent achieves cost reduction while maintaining pattern resolution through computational correction of the pattern design data to compensate for diffraction effects.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of operation

If gap of 50 μm or more is provided between mask and exposed body, then ease of operation is improved, but pattern size smaller than ten times wavelength cannot be formed

Engineering Contradiction:
Improveease of operationVSAvoidpattern size
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-correcting the pattern design data to account for Fresnel diffraction effects that occur with large gaps. This allows operators to maintain a comfortable 50 μm or greater gap between mask and exposed body for ease of operation, while the pre-calculated corrections ensure that fine patterns smaller than ten times the wavelength are still formed with high precision.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed photomask design significantly improves resolution in proximity exposure, enabling the formation of fine patterns with high contrast and minimal distortion, similar to projection exposure methods, while reducing costs by eliminating the need for expensive lenses.

Implementation Method 1

auxiliary pattern portions that transmit in-phase light to enhance light intensity at the outline of the desired pattern

Methodology Applied
Scientific EffectInterference: Interference

Implementation Method 2

pattern distortion caused by Fresnel diffraction

Methodology Applied
Scientific EffectFresnel diffraction: Fresnel Diffraction

Data Source

PatentUS9658524B2Photomask, and method for creating pattern data thereof, and pattern forming method and processing method using photomask
Publication Date: 2017.05.23 PANASONIC SEMICON SOLUTIONS CO LTD
  • US9658524B2 patent drawing
  • US9658524B2 patent drawing
  • US9658524B2 patent drawing

AI summary

A photomask includes: a light blocking member provided on a translucent substrate; a main pattern portion provided in a first region corresponding to a desired pattern, being an opening of the light blocking member; and an auxiliary pattern portion provided in a second region surrounding the position corresponding to the desired pattern and along a side constituting an outline portion of the desired pattern, including a plurality of in-phase auxiliary patterns each of which is an opening transmitting in-phase light with light transmitted through the main pattern portion. The in-phase auxiliary pattern is provided at a distance of √(2×n×G×λ) from the side constituting the outline portion of the desired pattern (where G is a gap length between the photomask and the exposed body, λ is a wavelength of the exposure light, and n is a natural number). The exposure light transmitted through the auxiliary pattern portion is projected on an exposed body to form a projection image having light intensity emphasized at the side constituting the outline portion of the desired pattern.