Photomask Layout Correction for Registration Error Compensation

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Solution Overview

Problem

As semiconductor design rules become smaller, there is a need for higher precision in photomask design and manufacturing due to increased position errors during the exposure process, which existing methods fail to adequately address.

Innovation Solution

A method that involves obtaining design data for a photomask layout, performing optical proximity correction, and compensating for position errors by rearranging the pattern on a grid to correct for registration errors, ensuring accurate exposure of the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If design rules become smaller to increase semiconductor device density, then productivity and device capacity improve, but manufacturing precision and position accuracy deteriorate due to increased position errors during exposure

Engineering Contradiction:
Improvesemiconductor device densityVSAvoidposition accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by measuring position errors using a measurement device before the actual exposure process, then using these measurements to calculate and apply correction values to the design data in advance. This ensures that when exposure occurs, the corrections are already incorporated, compensating for systematic position errors and maintaining manufacturing precision even as design rules shrink.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If existing photomask design methods are used without position error compensation, then manufacturing process remains simple, but registration errors increase leading to wafer overlay defects

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidregistration accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent implements feedback by using the measurement device to actually measure position errors that occur during exposure, then feeding this measured information back into the design data correction process. The correction values are calculated based on actual measured errors rather than theoretical predictions, creating a closed-loop system that continuously improves registration accuracy while maintaining manufacturing feasibility.

Inventive Principle:
Principle #23Feedback

3Manufacturing precision

If position error data is obtained and design data is corrected to compensate for position errors, then manufacturing precision improves, but device complexity increases due to additional measurement and correction steps

Engineering Contradiction:
Improveposition accuracyVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a measurement device and correction system that can be integrated into the existing photomask manufacturing workflow. The measurement device serves multiple functions: it measures position errors, provides data for correction calculations, and validates the correction effectiveness. This multi-functional approach reduces the need for separate dedicated systems, thereby limiting the increase in device complexity while achieving improved manufacturing precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10852636B2Method of designing layout of photomask and method of manufacturing photomask
Publication Date: 2020.12.01 SAMSUNG ELECTRONICS CO LTD
  • US10852636B2 patent drawing
  • US10852636B2 patent drawing
  • US10852636B2 patent drawing

AI summary

A method of designing a layout of a photomask and a method of manufacturing a photomask, the method of designing a layout of a photomask including obtaining a design layout of a mask pattern; performing an optical proximity correction on the design layout to obtain design data; obtaining data of a position error of a pattern occurring during an exposure of the photomask according to the design data; correcting position data of the pattern based on the position error data to correct the design data; and providing the corrected position data to an exposure device to expose an exposure beam according to the corrected design data.