Photo-mask Non-printable Pattern Reduces Lens Heat
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Solution Overview
Problem
In semiconductor manufacturing, existing photo-masks with circuit layouts face challenges in maintaining lens integrity and precision due to heat absorption and focusing errors caused by light transmission, leading to deformation and short lens lifetime, as well as issues with line width control and redundant pattern formation.
Innovation Solution
A photo-mask design featuring a substrate with a non-printable pattern smaller than the critical resolution of lithography equipment, which is not transferred to the photo-resist layer, reducing light transmission and heat absorption, thereby preventing lens deformation and ensuring accurate circuit pattern transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a photo-mask with circuit layout is used in lithography process, then the circuit pattern can be transferred to semiconductor substrate, but the lenses of lithography equipment absorb heat and deform leading to focusing errors and short lifetime
Solution Approach 1:
The patent extracts and removes the harmful function of light transmission through the photo-mask substrate. By making the substrate light-blocking (opaque) instead of light-transmitting, the harmful heat absorption by lenses is eliminated while the useful function of pattern transfer is maintained through the pattern layer alone.
Solution Approach 2:
The patent converts the harmful effect of light transmission (heat absorption by lenses) into a beneficial configuration by using a light-blocking substrate. The substrate that would normally transmit light and cause heating is instead made opaque, turning the potential harm into a solution that prevents lens deformation while maintaining pattern transfer capability through the pattern layer.
2Ease of manufacture
If light transmission through photo-mask substrate is allowed, then the exposing process can be performed, but lens deformation and focusing errors occur due to heat absorption
Solution Approach 1:
The patent separates the light transmission function from the substrate and assigns it solely to the pattern layer. The substrate is made light-blocking, extracting the harmful heat transmission path while the pattern layer maintains the necessary light transmission for exposing, thereby preventing lens deformation and focusing errors.
3Productivity
If photo-mask with traditional design is used, then circuit patterns can be formed, but redundant patterns are formed and line width control is poor
Solution Approach 1:
The patent removes the substrate's light transmission function, leaving only the pattern layer to define the circuit patterns. This eliminates redundant pattern formation that occurs when light transmits through the substrate, improving line width control while maintaining pattern formation capability through the optimized pattern layer design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat absorption by the lenses, prevents focusing errors, and avoids redundant pattern formation, enhancing the semiconductor manufacturing process by maintaining lens integrity and precision while ensuring accurate circuit pattern transfer.
Implementation Method 1
reducing light transmission and heat absorption, thereby preventing lens deformation
Data Source
AI summary
A photo-mask and a semiconductor process are provided. The photo-mask includes a substrate and a non-printable pattern on the substrate. A pattern size of the non-printable pattern is smaller than a critical resolution of a lithography equipment using the photo-mask to perform a lithography process.