Photon-Counting Detector TSV Layout Without Interlayer Substrate
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Solution Overview
Problem
Existing photon-counting detectors face challenges in stability, reliability, power consumption, and manufacturing cost, necessitating improvements for enhanced performance and efficiency.
Innovation Solution
A photon-counting detector design that omits the substrate between the sensor layer and the chip, utilizing silicon through-holes (TSVs) for signal transmission, reducing thickness and alignment length, and incorporating a chip with processing circuits for improved reliability and reduced power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a substrate is included between the sensor layer and the chip, then structural support is provided, but thickness and alignment length increase
Solution Approach 1:
The patent removes the substrate component from the detector structure, directly bonding the chip to the sensor layer. This extraction of the unnecessary substrate eliminates the thickness and alignment length issues while maintaining structural integrity through alternative support mechanisms within the chip-sensor layer bonding interface.
Solution Approach 2:
The patent merges the functions previously separated by the substrate into the direct chip-to-sensor-layer interface. The chip structure itself provides both the electrical connection and the mechanical support, eliminating the need for a separate substrate component and reducing overall thickness.
2Strength
If a substrate is included between the sensor layer and the chip, then structural support is provided, but alignment length increases
Solution Approach 1:
The patent removes the substrate component from the detector structure, directly bonding the chip to the sensor layer. This extraction of the unnecessary substrate eliminates the alignment length issues while maintaining structural integrity through alternative support mechanisms within the chip-sensor layer bonding interface.
3Ease of manufacture
If traditional detector structure is used, then manufacturing process is established, but manufacturing cost and complexity increase
Solution Approach 1:
The patent removes the substrate component and its associated mounting and alignment processes, simplifying the manufacturing workflow. The direct bonding of chip to sensor layer reduces the number of assembly steps and lowers manufacturing complexity while maintaining ease of production through standardized bonding techniques.
Solution Approach 2:
The patent merges multiple functions into the chip-to-sensor-layer direct bonding interface, consolidating structural support, electrical connection, and signal transmission into a single integrated interface. This merging reduces the number of discrete components and assembly operations, thereby reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves reduced thickness, lower power consumption, and enhanced reliability, thereby simplifying packaging and lowering manufacturing costs while maintaining effective signal transmission and processing capabilities.
Implementation Method 1
a sensor layer configured to detect incident radiation photons and generate electrical signals
Data Source
Figure 1A
Figure 1B
Figure 2A~2B
AI summary
The present disclosure provides a photo-counting detector. The photo-counting detector may include a sensor layer, a chip, and a substrate. The sensor layer may be configured to detect incident radiation photons and generate electrical signals. The chip may be electrically connected with the sensor layer and including a plurality of connection components through the chip and one or more processing circuits, wherein each of the one or more processing circuits are electrically connected with one or more parts of the sensor layer through at least one of the plurality of connection components. The substrate may be electrically connected with the chip.