Photon-Counting Detector TSV Layout for Thinner, Lower-Power Packaging
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Solution Overview
Problem
Existing photon-counting detectors face challenges in stability, reliability, power consumption, and manufacturing cost, necessitating improvements for enhanced performance and cost-effectiveness.
Innovation Solution
The photon-counting detector design omits a substrate between the sensor layer and the chip, utilizing silicon through-holes (TSVs) for signal transmission, reducing thickness and improving reliability and stability while lowering power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a substrate is used between the sensor layer and the chip, then structural support is provided, but package thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent removes the substrate component from the detector structure, directly bonding the chip to the sensor layer. This extraction of the substrate eliminates the need for additional structural support while reducing overall package thickness and simplifying the manufacturing process.
Solution Approach 2:
The patent merges the functions of the substrate and the bonding interface by directly bonding the chip to the sensor layer. This integration eliminates the need for a separate substrate while maintaining structural integrity and reducing the number of components.
2Strength
If a substrate is used between the sensor layer and the chip, then structural support is provided, but manufacturing cost and complexity increase
Solution Approach 1:
The patent removes the substrate component from the detector structure, directly bonding the chip to the sensor layer. This extraction of the substrate eliminates the need for additional structural support while reducing overall package thickness and simplifying the manufacturing process.
Solution Approach 2:
The patent merges the functions of the substrate and the bonding interface by directly bonding the chip to the sensor layer. This integration eliminates the need for a separate substrate while maintaining structural integrity and reducing the number of components.
3Reliability
If traditional connection methods are used between sensor layer and chip, then connection is achieved, but power consumption is high
Solution Approach 1:
The patent replaces traditional mechanical connection methods (such as wire bonding or bump bonding) with a direct bond interface between the chip and sensor layer. This substitution eliminates intermediate connection structures that consume power, achieving reliable signal transmission with reduced power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces package thickness, simplifies manufacturing, lowers power consumption, and enhances reliability, thereby improving the overall performance and cost-effectiveness of the detector.
Implementation Method 1
a sensor layer, a chip and a substrate. The sensor layer is configured to detect incident radiation photons and generate electrical signals
Data Source
Figure 1A
Figure 1B
Figure 2A~2B
AI summary
A photon-counting detector includes a sensor layer (201, 251), a chip (202, 252, 300, 350), and a substrate (203, 253). The sensor layer (201, 251) may be configured to detect incident radiation photons and generate electrical signals. The chip (202, 252, 300, 350) may be electrically connected with the sensor layer (201, 251) and include a plurality of connection components through the chip (202, 252, 300, 350) and one or more processing circuits (304, 354), wherein each of the one or more processing circuits (304, 354) are electrically connected with one or more parts of the sensor layer (201, 251) through at least one of the plurality of connection components. The substrate (203, 253) may be electrically connected with the chip (202, 252, 300, 350).