Photonic Adaptor Alignment Pins for Re-connectorizable Optical Coupling
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Solution Overview
Problem
Existing methods for coupling optical fibers to optoelectronic substrates are not re-connectorizable and cannot withstand high temperatures during soldering processes, leading to potential damage or destruction of the optical connection.
Innovation Solution
A photonic adaptor with alignment pins and a supporting substrate that allows for re-connectorization and high-temperature compatibility, using low CTE materials and mechanical coupling to maintain alignment and efficiency across a wide temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive UV curing is used to bond optical fibers to the optoelectronic substrate, then the optical connection is established, but the connection cannot be released without damaging the assembly and the assembly cannot withstand high soldering temperatures
Solution Approach 1:
The invention divides the connection system into separate components: a support structure that is permanently attached to the substrate, and optical connectors that can be independently mated and unmated. This segmentation allows the support structure to remain while connectors are replaced, enabling re-connectorization without damaging the underlying assembly.
Solution Approach 2:
The invention introduces a support structure as an intermediary component between the substrate and the optical connectors. This mediator provides a stable mounting platform that can withstand soldering temperatures while allowing connectors to be attached and detached, thus resolving the contradiction between connection reliability and re-connectorization capability.
2Reliability
If adhesive UV curing is used to bond optical fibers to the optoelectronic substrate, then the optical connection is established, but the assembly cannot withstand high temperatures during soldering processes
Solution Approach 1:
The support structure serves as a heat-resistant intermediary that is directly attached to the substrate and can withstand soldering temperatures. The optical connectors are then mounted on this support structure, allowing the assembly to undergo soldering processes without damaging the optical connection, as the support structure protects the connectors from direct thermal exposure.
Solution Approach 2:
The support structure is attached to the substrate before the soldering process occurs. This preliminary attachment creates a thermally stable platform that can endure the high temperatures of subsequent soldering operations, preventing damage to the optical connectors and maintaining connection stability throughout the thermal process.
3Adaptability or versatility
If mechanical coupling with alignment pins is used, then re-connectorization is enabled and high-temperature compatibility is achieved, but device complexity increases
Solution Approach 1:
The invention combines multiple functions into a single support structure: mechanical support, alignment reference, and connector mounting. By merging these functions into one integrated component rather than using separate elements, the design achieves re-connectorization capability and alignment precision without proportionally increasing overall device complexity.
Solution Approach 2:
The support structure is designed as a universal component that can accommodate different optical connectors through standardized alignment features. This multi-functional design allows the same support structure to work with various connector types, reducing the need for multiple specialized components and thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables re-connectorization of optical connections and withstands high temperatures during soldering processes, ensuring reliable and efficient data transfer between optical fibers and optoelectronic substrates.
Implementation Method 1
at least one alignment pin projecting out of at least the first face side of the photonic adaptor, wherein the at least one alignment pin is configured to be inserted in the optical connector terminating the optical cable to align optical fibers of the optical cable to the optical fibers of the photonic adaptor
Implementation Method 2
A photonic adaptor for providing an interface between an optical connector and an optoelectronic substrate... for transferring optical data between the optoelectronic substrate and the optical cable
Data Source
AI summary
A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.