Photonic Integrated Circuit Arrays With Shared Conductors for Compact Routing
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Solution Overview
Problem
The increasing demand for higher data rates in photonic integrated circuits (PICs) leads to challenges in layout and electrical routing due to the need for numerous digital-to-analog and analog-to-digital converters, which occupy significant space and increase die size or require larger substrates, especially for implementations with more than eight channels.
Innovation Solution
A photonic integrated circuit (PIC) device operated by electrical signals, incorporating control and common conductors, photonic devices, and switching diodes that switch between reverse and forward bias, allowing for multiplexing and reduced converter requirements through series connections and shared monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of channels in a PIC transceiver is increased, then the data rate capability is improved, but the layout complexity and electrical routing become more challenging
Solution Approach 1:
The patent segments the control of multiple photonic components by dividing them into groups that share common conductors. Instead of providing dedicated control lines for each component, the system uses a segmented approach where multiple components are controlled through shared control paths, reducing the overall routing complexity while maintaining high channel capacity
Solution Approach 2:
The common conductor serves multiple functions: it provides control signals to multiple photonic components simultaneously, acts as a shared monitoring path, and enables multiplexed operation. This multi-functional design reduces the number of separate control lines needed, directly addressing the layout complexity issue
2Productivity
If the number of D/A and A/D converters is increased, then the channel capacity is improved, but the package size increases
Solution Approach 1:
The patent merges the control and monitoring functions into shared pathways. Multiple photonic components are controlled through a common conductor that is time-multiplexed or signal-multiplexed, allowing a single D/A converter to control multiple components and a single A/D converter to monitor multiple components, thereby reducing the total number of converters needed
Solution Approach 2:
The system uses periodic or time-multiplexed control signals where a single control line is sequentially activated to control different photonic components. This periodic activation pattern allows one D/A converter to serve multiple channels over time, reducing the converter count and package area
3Device complexity
If monolithic integration of control EIC with PIC device is used, then the packaging complexity is reduced, but the die size increases
Solution Approach 1:
The patent segments the control function by providing separate control conductors that can be independently routed and controlled. This segmentation allows the control EIC to be implemented with fewer resources on the same die, reducing the overall die size while maintaining integration benefits
Solution Approach 2:
The patent moves from a planar integration approach to a three-dimensional control architecture where control signals are routed through vertical stacks and layered structures. This dimensional transition allows control EIC components to be packed more efficiently, reducing the footprint area required on the die
4Adaptability or versatility
If co-packaging of control EIC with PIC device is used, then the integration flexibility is improved, but the substrate real estate requirement increases
Solution Approach 1:
The patent segments the control signals into separate conductors that can be independently packaged and routed. This segmentation enables modular co-packaging where control EIC components are placed adjacent to but separate from the PIC device, allowing flexible substrate layout that minimizes the total real estate required
Solution Approach 2:
The patent introduces intermediary control conductors that serve as bridges between the PIC device and control EIC components. These intermediary lines enable signal transmission with minimal routing distance and allow for compact substrate designs by mediating the connection between separate functional blocks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the complexity and size of the PIC package by minimizing the number of converters and connections, enabling efficient multiplexing and monitoring of multiple photonic components while reducing crosstalk and electrical routing complexity.
Implementation Method 1
the switching diode is configured to switch between reverse and forward bias in response to the electrical signals
Implementation Method 2
The at least one optical coupling of the PIC device is disposed in optical communication with the at least one optical port
Data Source
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AI summary
A photonic integrated circuit (PIC) device has photonic devices arranged in an array with respect to control and common conductors. Each of the photonic devices has a photonic component (e.g., photodiode, thermo-optic phase shifter, etc.) and a switching diode connected in series with one another between a control connection and a common connection. The photonic component has at least one optical port, which can be coupled to a waveguide in the PIC device. The switching diode is configured to switch between reverse and forward bias in response to the electrical signals. In this way, control circuitry for providing control and monitoring signals to the conductors can be greatly simplified, and the PIC device can be more compact.