Embedded Photonic Bridge Die Packaging With Protected Optical Exposure
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Solution Overview
Problem
Existing semiconductor devices face challenges in exposing photonic circuits of bridge die to the outside world while maintaining the integrity of the package structure, as photonic circuits require external stimulus but are sensitive to encapsulants during manufacturing processes.
Innovation Solution
The implementation of protective measures such as epoxy dams, lids, photoresist layers, and pre-formed optical epoxy blocks to shield photonic circuits during the embedding process, ensuring they remain exposed and functional within the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If photonic circuits are exposed to allow external stimulus, then photonic functionality is enabled, but photonic circuits are vulnerable to damage from encapsulants during manufacturing
Solution Approach 1:
A protective layer is formed over the photonic circuit before the encapsulant is applied during manufacturing. This preliminary protective measure ensures the photonic circuit is shielded from potential damage by the encapsulant while still allowing the circuit to function. The protective layer is later removed or made transparent after encapsulation is complete, leaving the circuit intact and functional.
Solution Approach 2:
A protective layer acts as an intermediary between the photonic circuit and the encapsulant. This intermediate layer prevents direct contact between the potentially harmful encapsulant and the sensitive photonic circuit, while still allowing the necessary optical stimulus to reach the circuit during operation.
2Reliability
If encapsulant is applied to protect semiconductor components, then package integrity is improved, but photonic circuits become covered and cannot receive external stimulus
Solution Approach 1:
The encapsulation process is segmented into distinct regions: a first region containing the photonic circuit that remains exposed or is protected by a removable layer, and a second region containing other semiconductor components that are fully encapsulated. This segmentation allows the package to have both protected and accessible areas as needed.
Solution Approach 2:
The encapsulant is applied selectively to specific regions of the package rather than uniformly across the entire surface. The photonic circuit region maintains different properties (exposed or protected) compared to other regions, allowing local optimization where the photonic circuit needs accessibility while other components receive full encapsulation protection.
3Productivity
If photonic circuits are embedded in bridge die, then high-bandwidth communication is achieved, but manufacturing complexity increases due to exposure requirements
Solution Approach 1:
The protective layer is formed over the photonic circuit during the bridge die fabrication process, before the bridge die is mounted in the final package. This preliminary protection simplifies subsequent manufacturing steps by preventing damage during handling and mounting, while the circuit remains functional throughout the manufacturing process.
Data Source
AI summary
A semiconductor device has a bridge die including a photonic circuit. An optical epoxy is deposited over the photonic circuit. The bridge die is disposed over a first interconnect structure. An encapsulant is deposited over the bridge die and first interconnect structure. A portion of the encapsulant is removed to expose the optical epoxy. A second interconnect structure is formed over the encapsulant with an opening in the second interconnect structure over the photonic circuit and optical epoxy. A first semiconductor die and second semiconductor die are disposed over the second interconnect structure. The first semiconductor die is electrically coupled to the second semiconductor die through the bridge die.