Photonic Chip Integration via Vertical IC Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Optical waveguide devices face challenges with high power consumption due to long electrical connections and tracks, signal loss, and undesirable waveguide crossings, which hinder the development of faster and more compact devices.
Innovation Solution
An optical waveguide device is designed with an integrated circuit forming an electrical bridge between photonic chips, minimizing electrical connections and eliminating waveguide crossings by arranging components in a stepped configuration, allowing direct vertical connections and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If electrical connections and tracks are extended to connect driver to optical modulator, then device functionality is achieved, but power consumption increases and signal loss occurs
Solution Approach 1:
The patent transitions from planar electrical connections to three-dimensional vertical connections by stacking the electronic chip above the photonic chip. This vertical arrangement dramatically shortens the electrical connection length between the driver and optical modulator, reducing both power consumption and signal loss while maintaining full device functionality.
Solution Approach 2:
The patent integrates the electronic driver chip and photonic modulator chip into a single stacked assembly, merging previously separate components into a unified structure. This integration eliminates long external electrical connections and reduces the overall device footprint.
2Productivity
If waveguide crossings are introduced to accommodate multiple components, then device functionality is achieved, but insertion losses and manufacturing yield decrease
Solution Approach 1:
The patent resolves waveguide crossing problems by separating optical paths into different vertical layers. Waveguides on the photonic chip operate in the horizontal plane, while electrical connections and additional waveguides are routed vertically through the stacked structure, eliminating the need for complex planar crossings and improving manufacturing yield.
3Length of stationary object
If photonic chip dimensions are increased to accommodate multiple features, then device functionality is achieved, but electrical track lengths increase causing unacceptable losses
Solution Approach 1:
The patent places the electronic driver chip vertically above the photonic chip, creating short vertical electrical connections that are independent of the photonic chip's horizontal dimensions. This allows the photonic chip to be enlarged to accommodate multiple waveguides and optical features without increasing electrical track lengths, since all electrical connections are made through the vertical stacking interface.
Data Source
AI summary
An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.