Photonic Integrated Chip Separating Optical and Electrical Interfaces
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Solution Overview
Problem
Existing multiplexed optical transmit assemblies in telecommunications devices have bulky packaging due to electrical inputs and optical inputs being on the same side, making integration with other equipment challenging.
Innovation Solution
A photonic integrated circuit (PIC) device with a common optical interface side featuring both optical input and output, and an electrical interface located on a different side, allowing for a compact design with optical components interacting without physically interfering with electrical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electrical inputs and optical inputs are located on the same side of the assembly, then the device structure is simpler, but the package becomes bulky and integration with other equipment becomes challenging
Solution Approach 1:
The patent applies dimensional reconfiguration by moving electrical inputs to the back side of the substrate while optical inputs remain on the front side. This spatial separation across different surfaces (dimensions) of the same substrate resolves the contradiction by maintaining structural simplicity while eliminating bulkiness, enabling compact integration with other telecommunication equipment.
2Device complexity
If electrical inputs and optical inputs are located on the same side of the assembly, then the device structure is simpler, but integration with other telecommunication equipment becomes challenging
Solution Approach 1:
By reconfiguring the device layout across different surfaces (front side for optical inputs, back side for electrical inputs), the patent enables better adaptability and versatility for integration with telecommunication equipment while preserving structural simplicity. This dimensional separation allows flexible mounting and connection options.
3Volume of moving object
If optical components and electrical components are located on the same side, then the device is more compact, but the components physically interfere with each other
Solution Approach 1:
The patent segments the device into distinct functional zones: optical components (optical inputs, optical circuit, optical outputs) are confined to the front side while electrical components (electrical inputs, electrical traces) are located on the back side. This spatial segmentation eliminates harmful interference between optical and electrical components while maintaining overall device compactness through integrated substrate design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PIC device achieves a more compact and versatile design by separating optical and electrical interfaces, enabling easier integration with other telecommunications equipment and reducing bulkiness while maintaining functionality.
Implementation Method 1
The at least one optical input and the at least one optical output can be optically joined and/or in optical communication with each other using a PIC optical bus and/or waveguide there between
Implementation Method 2
The optical circuit can include, but is not limited to, one or more optical ring resonators on the optical bus
Data Source
AI summary
A photonic integrated chip device having a common optical edge interface is provided and specifically a device comprising: a photonic integrated circuit (PIC) chip comprising: an optical circuit; and an electrical interface configured to receive electrical signals for controlling the optical circuit; and, a common optical interface side of the PIC chip comprising: at least one input configured to receive light into the PIC chip to the optical circuit; and at least one output configured to convey at least one optical signal from the optical circuit out of the PIC chip, the electrical interface located on one or more electrical interface sides of the PIC chip different from the common optical interface side.