Photonic Chip Optical Coupling via Reflecting Mirror Alignment
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Solution Overview
Problem
The challenge in photonics is achieving precise alignment of optical chips for efficient light coupling, as small misalignments lead to significant coupling loss, requiring complex and costly active alignment methods with limited throughput.
Innovation Solution
A system comprising a first photonics chip with an optical emitter and a focusing mirror, and a second photonics chip with a reflecting mirror, where the reflecting mirror reflects light back to the first chip, and the focusing mirror further reflects and focuses it onto an optical receiver, increasing alignment tolerances and enabling passive alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional direct coupling between optical chips is used, then coupling efficiency is maximized under perfect alignment, but alignment tolerance is extremely small (1-2 microns) requiring complex active alignment
Solution Approach 1:
The patent introduces a reflecting mirror as an intermediary optical element between the optical emitter on the first chip and the optical receiver on the second chip. This mirror enables indirect light coupling paths that are less sensitive to misalignment, thereby increasing alignment tolerance from 1-2 microns to greater than 10 microns while simplifying the alignment process
Solution Approach 2:
The patent employs multiple reflection paths and introduces spatial dimensionality to the light coupling process. By using a reflecting mirror to create indirect coupling paths through additional spatial dimensions, the system achieves greater tolerance to misalignment in the primary coupling direction
2Manufacturing precision
If active alignment methods are used to achieve precise alignment, then coupling efficiency is improved, but throughput decreases and cost increases
Solution Approach 1:
The patent implements passive alignment techniques where the optical components are pre-positioned using alignment marks and mechanical features before final assembly. This preliminary positioning eliminates the need for time-consuming active alignment procedures during manufacturing, thereby increasing throughput while maintaining adequate alignment precision
Solution Approach 2:
The system incorporates self-aligning features such as alignment marks and mechanical reference structures that automatically guide the relative positioning of optical chips. This self-service alignment mechanism eliminates the need for complex active alignment equipment and procedures, improving manufacturing throughput
3Manufacturing precision
If integrated lenses are used to focus light between chips, then coupling efficiency is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent removes the integrated lens from the optical chip structure and replaces it with a reflecting mirror-based focusing system. This extraction simplifies the chip manufacturing process while maintaining the ability to focus light for efficient coupling, as the mirror can be fabricated using standard semiconductor fabrication techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances alignment tolerances by more than five times, allowing for passive alignment, reducing costs and increasing throughput, and simplifies the assembly process by eliminating the need for an integrated lens, while maintaining high coupling efficiency.
Implementation Method 1
a reflecting mirror on the second photonics chip or IC, wherein the reflecting mirror is configured to reflect light transmitted by the optical emitter or optical transmission mechanism back to the first photonics chip or IC
Implementation Method 2
a focusing mirror on the first photonics chip or IC, wherein the focusing mirror is configured to (i) further reflect the light reflected by the reflecting mirror and (ii) focus the further reflected light on the optical receiver
Implementation Method 3
the focusing mirror is configured to (i) further reflect the light reflected by the reflecting mirror and (ii) focus the further reflected light on the optical receiver
Data Source
AI summary
Embodiments of the disclosure pertain to a system for transferring an optical signal from one photonics chip or integrated circuit (PIC) to another. The system includes a first PIC having (i) an optical emitter or optical transmission mechanism and (ii) a focusing mirror thereon, and a second PIC having an optical receiver and a reflecting mirror thereon. The reflecting mirror is configured to reflect light transmitted by the optical emitter or optical transmission mechanism back to the first PIC. The focusing mirror is configured to (i) further reflect the light reflected by the reflecting mirror and (ii) focus the further reflected light on the optical receiver. Methods of using and manufacturing the system are also disclosed.