3D Photonic Chip Structure With Optical Block for Low-Loss Coupling
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently integrating optical and electronic circuits, leading to suboptimal coupling efficiency and performance in data transmission.
Innovation Solution
A photonic chip structure is introduced, featuring an optical integrated circuit chip with a PIC connection pad and insulating layer, and an optical block spaced apart to provide a path for optical signals, along with an electronic integrated circuit chip connected via a connection terminal and through electrode, enhancing coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical and electronic circuits are integrated in existing semiconductor packages, then functionality is improved, but coupling efficiency deteriorates
Solution Approach 1:
The patent introduces a dedicated optical block as an intermediary component between the electronic integrated circuit chip and the optical integrated circuit chip. This optical block contains optical waveguides that serve as mediators for signal transmission, effectively decoupling the electrical and optical domains while maintaining efficient signal coupling. The intermediary structure resolves the contradiction by providing specialized optical pathways rather than direct integration.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking, placing the optical integrated circuit chip underneath the electronic integrated circuit chip in the vertical direction. This dimensional change allows optical and electronic circuits to coexist without interfering with each other's signal paths, improving coupling efficiency while maintaining enhanced functionality through vertical integration.
2Productivity
If optical circuits are integrated with electronic circuits, then data transmission capability is improved, but optical loss increases
Solution Approach 1:
The optical block acts as an intermediary that contains optimized optical waveguide pathways, reducing optical loss by providing dedicated low-loss transmission channels. This mediator structure separates optical signal paths from electronic circuitry, minimizing interference and attenuation while maintaining high data transmission capability.
Solution Approach 2:
The patent implements local optimization of optical pathways within the optical block, where the waveguide structure and material composition are specifically tailored for low-loss optical transmission in critical regions. This localized quality enhancement reduces optical loss in the data transmission path while maintaining overall system functionality.
Data Source
AI summary
A photonic chip structure may include: an electronic integrated circuit chip; a connection terminal connected to the electronic integrated circuit chip; an optical integrated circuit chip under the electronic integrated circuit chip and the connection terminal in a vertical direction and including a photonic integrated circuit (PIC) connection pad and a first PIC insulating layer on the PIC connection pad, the PIC connection pad connected to the connection terminal; and an optical block spaced apart from the electronic integrated circuit chip in a horizontal direction and configured to provide a path for optical signals to the optical integrated circuit chip, wherein the first PIC insulating layer includes a first cavity, and the optical block is in the first cavity.