Optomechanical Assembly for Photonic Chip Light Coupling
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Solution Overview
Problem
The miniaturization of optical and optoelectronic components poses challenges in efficiently coupling light between photonic chips and external environments due to the requirement for large space to accommodate fiber bend radii and the resulting optomechanical assembly size issues, whether through side or vertical coupling methods.
Innovation Solution
The use of a planar lightwave circuit (PLC) in combination with vertical coupling gratings on a photonic chip allows for compact packaging by eliminating the need for fiber ribbons and optimizing the alignment of optical components, enabling efficient light coupling between the photonic chip and optical connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fiber array coupling is used to connect photonic chip to optical connector, then optical coupling is achieved, but large space is required to accommodate fiber bend radius
Solution Approach 1:
The patent extracts the fiber ribbon component from the coupling system and replaces it with a planar lightwave circuit. This elimination of unnecessary components directly reduces the space required for fiber bend radius while maintaining optical coupling functionality between the photonic chip and optical connector
Solution Approach 2:
The patent replaces the mechanical fiber array coupling system with an integrated planar lightwave circuit system. This substitution eliminates the need for physical fiber ribbons and their associated bend radius requirements, achieving compact packaging while preserving optical coupling reliability
2Area of stationary object
If vertical coupling gratings are used on photonic chip, then fiber ribbons are eliminated and package size is reduced, but alignment precision between PLC and photonic chip must be maintained
Solution Approach 1:
The patent merges the alignment function into the vertical coupling grating structure itself, which is fabricated directly on the photonic chip. This integration ensures that the grating positions are pre-aligned with the waveguides during chip manufacturing, maintaining manufacturing precision while enabling compact vertical coupling
Solution Approach 2:
The vertical coupling gratings are fabricated in advance on the photonic chip during the chip manufacturing process, establishing precise alignment positions before the planar lightwave circuit is attached. This preliminary alignment action eliminates the need for post-assembly alignment adjustments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a significantly more compact optomechanical assembly that effectively addresses the size and alignment challenges, enhancing the integration of photonic chips with optical connectors while maintaining efficient light coupling.
Implementation Method 1
vertical coupling gratings, which enable a fiber array to be coupled to a planar surface of the chip at a nearly straight angle
Implementation Method 2
a first plurality of PLC optical waveguides optically coupled to the at least one optical port and extending to the second end
Data Source
AI summary
An optomechanical assembly for a photonic chip is disclosed. The optomechanical assembly may include a planar lightwave circuit optically coupled to a plurality of vertical coupling gratings on the photonic chip, to couple light between an optical connector abutting the planar lightwave circuit and the photonic chip.