Photonic Chip Stacking Structure for Stable Optical Packaging
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving improved structural stability and durability, particularly in integrating photonic integrated circuit chips, which are crucial for data centers and communication infrastructure.
Innovation Solution
A chip structure is designed with a redistribution structure, an electronic integrated circuit chip, and a photonic integrated circuit chip featuring a first substrate with reflectors and wiring structures, including waveguides and grating couplers, to enhance structural integrity and optical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If photonic integrated circuit chips are integrated into semiconductor packages, then functionality and data transmission capability are improved, but structural stability and durability deteriorate
Solution Approach 1:
The photonic integrated circuit chip is segmented into multiple functional layers including a first substrate, a first wiring structure with waveguides and grating couplers, and a first reflector. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall structural stability through controlled interfaces between layers.
Solution Approach 2:
The patent introduces a vertical stacking dimension by placing the photonic integrated circuit chip above an electronic integrated circuit chip, with patterned surfaces facing downward. This three-dimensional integration approach improves functionality without proportionally increasing the horizontal footprint, thereby maintaining structural stability while enhancing capability.
2Productivity
If photonic integrated circuit chips are integrated into semiconductor packages, then data transmission capability is improved, but package durability deteriorates
Solution Approach 1:
The patterned surface of the photonic integrated circuit chip is prepared in advance with specific optical characteristics, and the first reflector is pre-configured to direct optical signals. This preliminary preparation ensures optimal optical performance from the start while reducing the need for post-assembly adjustments that could compromise durability.
Solution Approach 2:
The first wiring structure acts as an intermediary between the optical components (grating couplers) and the electronic integrated circuit chip below. This intermediary layer protects the delicate optical pathways while enabling high-speed data transmission, thereby improving productivity without sacrificing durability.
3Reliability
If complex photonic integrated circuit structures are implemented, then optical signal transmission is improved, but manufacturing complexity increases
Solution Approach 1:
The first substrate serves multiple functions: it provides mechanical support, carries the first wiring structure with optical pathways, and interfaces with the electronic integrated circuit chip. This multi-functionality reduces the number of separate components needed, thereby improving optical signal transmission reliability while reducing manufacturing complexity.
Solution Approach 2:
Instead of placing optical components on the top surface of the photonic integrated circuit chip, the patent inverts the approach by placing the patterned surface facing downward toward the electronic chip. This inversion simplifies the overall package structure and reduces manufacturing steps while maintaining optimal optical signal transmission through the first reflector and wiring structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced structural stability and durability, enabling efficient optical signal transmission and reduced package size, suitable for high-bandwidth applications in data centers and communication infrastructure.
Implementation Method 1
a first reflector on the inactive surface of the first substrate... the first reflector is configured to reflect optical signals reflected from the first reflector to be incident on a non-patterned surface of the grating coupler
Implementation Method 2
a first wiring structure on the active surface of the first substrate, the first wiring structure comprising a waveguide, a grating coupler... the second reflector is configured reflect optical signals reflected from the second reflector to be incident on the patterned surface of the grating coupler
Data Source
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AI summary
Provided is a chip structure (200) including a redistribution structure (210), an electronic integrated circuit chip (220) on an upper surface of the redistribution structure (210), and a photonic integrated circuit chip (230) including a first substrate (231) on an upper surface of the electronic integrated circuit chip (220) and comprising an active surface (231_A) and an inactive surface (231_UA) opposite to the active surface (231_A), a first reflector (233) on the inactive surface (231_A) of the first substrate (231), and a first wiring structure (235) on the active surface (231_A) of the first substrate (231), the first wiring structure (235) comprising a waveguide (232), a grating coupler (232_GC), and a second reflector (234), wherein a patterned surface (GC_P) of the grating coupler (232_GC) faces the redistribution structure (210). Provided is also a semiconductor package including the chip structure (200).