Photonic Chip Package Structure for Thermal Wavelength Stability
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Solution Overview
Problem
The temperature stability of optical integrated circuits in semiconductor packages is challenging due to their location away from cooling systems, leading to significant light wavelength variations and robustness issues, while the thickness of these components needs to be reduced for improved signal bandwidth.
Innovation Solution
A photonic chip structure with an optical integrated circuit chip featuring a grating coupler, a lens, and a connection layer, along with a semiconductor package design that includes a package substrate, interposer, and chip structures with through-electrodes and lenses for optical signal reception, enhancing thermal stability and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the thickness of optical integrated circuit components is reduced to improve signal bandwidth, then signal bandwidth is improved, but structural robustness deteriorates
Solution Approach 1:
The patent employs composite material structures in the optical integrated circuit chip, combining different materials with complementary properties to achieve both thin profile and structural strength. The chip integrates photonic components made from specialized semiconductor materials that provide both optical functionality and mechanical support at reduced thickness.
2Volume of moving object
If optical integrated circuits are positioned away from cooling systems to improve packaging density, then packaging compactness is improved, but temperature stability deteriorates
Solution Approach 1:
The patent introduces an intermediary thermal management structure that bridges the optical integrated circuit chip and the cooling system. This intermediary layer efficiently conducts heat away from the chip while maintaining compact packaging, resolving the conflict between proximity to cooling systems and packaging density.
3Stability of the object's composition
If temperature control of optical integrated circuits is improved to reduce light wavelength variation, then optical stability is improved, but device complexity increases
Solution Approach 1:
The patent merges the thermal management function with the existing packaging structure by integrating cooling channels and thermal pathways into the package substrate and interposer. This consolidation achieves effective temperature control without adding separate, complex thermal management subsystems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more compact and thermally stable photonic chip structure and semiconductor package, improving temperature control and reducing light wavelength variations, thereby enhancing the robustness and functionality of electronic equipment.
Implementation Method 1
a lens on a second surface of the optical integrated circuit chip opposite to the first surface of the optical integrated circuit chip, the lens configured to receive an optical signal
Implementation Method 2
the optical integrated circuit chip comprises a grating coupler configured to couple the optical signal received via the lens
Implementation Method 3
a connection layer between the electronic integrated circuit chip and the optical integrated circuit chip and comprising a conductive pad bonded to the PIC connection pad
Data Source
AI summary
A photonic chip structure includes: an optical integrated circuit chip including a photonic integrated circuit (PIC) connection pad on a first surface of the optical integrated circuit chip; an electronic integrated circuit chip below the first surface of the optical integrated circuit chip and including a through-electrode; a connection layer between the electronic integrated circuit chip and the optical integrated circuit chip and including a conductive pad bonded to the PIC connection pad; and a lens on a second surface of the optical integrated circuit chip opposite to the first surface of the optical integrated circuit chip, the lens configured to receive an optical signal, wherein the optical integrated circuit chip includes a grating coupler configured to couple the optical signal received via the lens.