Photonic Integrated Circuit Reflection Layer for 3D Light Coupling
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Solution Overview
Problem
Existing photonic integrated circuits face challenges in efficiently coupling light from a waveguide core to an optoelectronic component in a different layer where evanescent coupling is not feasible, leading to emission losses and crosstalk, especially in material systems like silicon nitride waveguides and silicon-based optoelectronics, and conventional redirecting elements are difficult to produce in large-scale production.
Innovation Solution
A photonic integrated circuit design that includes a reflection layer intersecting with the waveguide core plane to reflect light sideways to the optoelectronic component, using a CMOS-compatible manufacturing process, with a cladding material and spacer layers to separate the waveguide core and optoelectronic component, and a reflection layer to enhance coupling efficiency without direct contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the waveguide and optoelectronic component are placed in separate layers with large distance, then integration flexibility is improved, but light coupling efficiency deteriorates
Solution Approach 1:
The patent transitions from planar coupling to three-dimensional coupling by placing the optoelectronic component in a separate layer at a distance, utilizing vertical stacking and lateral displacement to achieve coupling through multiple spatial dimensions. This allows integration flexibility while maintaining coupling efficiency through the reflection layer that redirects light at angles.
Solution Approach 2:
The reflection layer acts as an intermediary element between the waveguide core and the optoelectronic component. It receives light from the waveguide, redirects it at specific angles, and guides it to the displaced optoelectronic component, enabling efficient coupling despite the spatial separation and layer displacement.
2Loss of energy
If conventional redirecting elements are used to couple light, then light coupling is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent modifies the refractive index parameters by introducing a reflection layer with specific optical properties between the waveguide and optoelectronic component. This parameter change enables efficient light redirection without requiring complex geometric structures, simplifying the manufacturing process while maintaining high coupling efficiency.
3Loss of energy
If direct or evanescent coupling is used, then coupling efficiency is improved, but design flexibility deteriorates
Solution Approach 1:
The patent employs three-dimensional spatial arrangement with the optoelectronic component displaced both vertically and laterally from the waveguide core. The reflection layer redirects light at specific angles to achieve coupling across this three-dimensional separation, providing design flexibility while maintaining coupling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces emission losses and improves coupling efficiency while allowing large-scale production, ensuring reliable and cost-effective integration of optoelectronic components without the need for direct physical contact or close proximity.
Implementation Method 1
a reflection layer for reflecting light emitted from the emitting structure to the optoelectronic component
Data Source
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AI summary
Photonic integrated circuit (1), comprising: - a cladding material (2); - a waveguide core (3) in the cladding material (2), extending in a waveguide core plane (4) and comprising an emitting structure (5) for deflecting and/or scattering and/or emitting light out of the waveguide core (3); - an optoelectronic component (6) arranged displaced from the waveguide core plane (4); wherein the photonic integrated circuit (1) further comprises a reflection layer (7) for reflecting light emitted from the emitting structure (5) to the optoelectronic component (6). Further a method for producing a photonic integrated circuit (1).