Photonic Integrated Circuits With Tilted Waveguide Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrating functionalities into photonic integrated circuits (PICs) is challenging due to issues like diffraction losses and the complexity of handling micron-scale silicon waveguides.
Innovation Solution
A photonic integrated circuit with a waveguide having a tilted surface for total internal reflection (TIR) mirrors and a functional surface directly deposited on an antireflection coating, using standard planar fabrication techniques, allows for efficient light interaction and minimizes diffraction losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If micron-scale silicon waveguides are used in photonic integrated circuits, then the circuit integration is improved, but diffraction losses increase
Solution Approach 1:
The patent introduces a vertical dimension by tilting the waveguide end surface at approximately 45 degrees relative to the waveguide axis. This dimensional change allows light to be reflected upward at a 90-degree angle from the original propagation direction, enabling compact L-shaped or U-shaped circuit layouts while maintaining efficient light coupling and minimizing diffraction losses through precise angular control
2Adaptability or versatility
If functionalities are integrated into photonic integrated circuits, then the device versatility is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the waveguide structure into distinct functional segments: the tilted end surface for light reflection, the antireflection coating for minimizing reflections, and the functional surface for light interaction. This segmentation allows each component to be optimized independently while maintaining compatibility with standard planar fabrication processes, thereby reducing overall manufacturing complexity
Solution Approach 2:
The patent creates a universal platform where the tilted waveguide structure with antireflection coating and functional surface can accommodate multiple different functionalities (sensing, modulation, detection) by simply changing the deposited functional surface material or structure, while keeping the underlying waveguide and coating architecture unchanged
3Ease of manufacture
If standard planar fabrication techniques are used for depositing functional surfaces, then the ease of manufacture is improved, but the precision of light interaction is worsened
Solution Approach 1:
The patent applies the antireflection coating to the waveguide end surface before depositing the functional surface. This preliminary action creates an optimized optical interface that minimizes reflections and prepares the surface for subsequent functional layer deposition, ensuring precise light interaction while maintaining compatibility with standard planar fabrication sequences
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective integration of functionalities in PICs, offering improved performance in optical communications, sensing, and imaging by reducing diffraction losses and simplifying the fabrication process.
Implementation Method 1
a waveguide with an end having a tilted surface for reflecting light with a total internal reflection (TIR) mirror
Implementation Method 2
the functional surface is directly deposited on to an antireflection coating of the waveguide
Data Source
AI summary
According to an example aspect of the present invention, there is provided a photonic integrated circuit, comprising: a waveguide with an end having a tilted surface for reflecting light with a total internal reflection (TIR) mirror, and a functional surface for interacting with the light reflected by the TIR mirror, wherein the functional surface is directly deposited on to an antireflection coating on the waveguide. According to another aspect of the present invention there is provided a method for manufacturing a photonic integrated circuit.