Photonic Integrated DAS Interrogator for Compact Phase Detection

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Solution Overview

Problem

Existing distributed acoustic sensing (DAS) systems are bulky, expensive, and power-hungry, limiting their adoption in portable and aerospace applications due to size, weight, and power consumption constraints, and they struggle to accurately characterize high-frequency acoustic or vibration signals along optical fibers.

Innovation Solution

A photonic integrated circuit (PIC) chip integrates various DAS interrogator components on a single chip, enabling low cost, small size, and low power consumption, with high extinction ratio optical pulses and coherent receivers to detect local phase disturbances along sensing fibers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional DAS systems use discrete optical components, then measurement precision is maintained, but device complexity and size increase significantly

Engineering Contradiction:
Improvedetection accuracyVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent integrates multiple discrete optical components (laser source, modulator, polarization controller, couplers, and coherent receivers) onto a single photonic integrated circuit chip. This merging maintains the functional capabilities and measurement precision of traditional discrete systems while dramatically reducing device complexity, size, and weight for portable and aerospace applications.

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If traditional DAS systems use multiple discrete components, then detection capability is maintained, but weight and power consumption increase

Engineering Contradiction:
Improvesignal detection capabilityVSAvoidsystem weight
Core Design Contradiction:
Measurement precisionVSWeight of moving object

Solution Approach 1:

By consolidating all DAS interrogator components onto one PIC chip, the system achieves significant weight reduction while preserving full signal detection capability. The integrated architecture eliminates the need for multiple separate components, directly addressing the weight constraint in portable and aerospace applications.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If traditional DAS systems use discrete components, then measurement accuracy is maintained, but cost increases

Engineering Contradiction:
Improvephase disturbance detection accuracyVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The photonic integrated circuit approach consolidates multiple expensive discrete optical components into a single manufactured chip, achieving economies of scale that reduce overall system cost while maintaining phase disturbance detection accuracy through preserved coherent detection functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The PIC chip serves multiple functions simultaneously (laser generation, modulation, polarization control, signal splitting, and coherent reception), replacing multiple specialized discrete components. This multi-functionality reduces both component count and overall system cost while maintaining measurement precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Measurement precision

If traditional DAS systems are used, then acoustic signal detection is achieved, but size and weight prevent portable application

Engineering Contradiction:
Improveacoustic signal detection accuracyVSAvoidsystem volume
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The integration of all DAS interrogator functions onto a single PIC chip dramatically reduces system volume and weight, enabling portable applications while preserving acoustic signal detection accuracy through maintained coherent detection capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The PIC chip enables efficient, cost-effective, and compact DAS systems capable of accurately characterizing high-frequency acoustic or vibration signals, suitable for diverse applications including seismic monitoring and infrastructure integrity.

Implementation Method 1

a laser supported by the substrate to produce laser light

Methodology Applied
Scientific EffectStimulated emission: Laser

Implementation Method 2

an optical modulator supported by the substrate and located to receive the laser light from the laser to produce laser pulses

Methodology Applied
Scientific EffectElectro-optic modulation: Electro-Optic Effects

Implementation Method 3

for sensing local phase disturbances at various locations along the sensing fiber by detecting backscattering light of the laser pulses

Methodology Applied
Scientific EffectRayleigh scattering: Rayleigh Scattering

Implementation Method 4

a polarization device supported by the substrate to receive the backscattered light from the sensing fiber and to split the received backscattered light from the sensing fiber into first optical beam in a first polarization and a second optical beam in a second polarization that is orthogonal to the first polarization and to rotate the second polarization of the second optical beam by 90 degrees

Methodology Applied
Scientific EffectPolarization splitting: Polarisation

Implementation Method 5

a first optical coherent receiver supported by the substrate to receive the two beams from the first optical coupler derived from the first optical beam in the first optical polarization to produce three or more first optical coherent receiver output signals that carry information of local phase disturbances

Methodology Applied
Scientific EffectOptical coherent detection: Homodyne Detection

Data Source

PatentUS20260063469A1Photonic integrated circuit chip for distributed acoustic sensing
Publication Date: 2026.03.05 YAO XIAOTIAN STEVE
  • US20260063469A1 patent drawing
  • US20260063469A1 patent drawing
  • US20260063469A1 patent drawing

AI summary

The disclosure of this patent document provides a photonic integrated circuit (PIC) chip for integrating various component of the distributed acoustic sensing (DAS) interrogator on the same chip to enable low cost, extremely small size and weight, and low power consumption for the adoption of various applications.