Semiconductor Package Waveguide Bridging for Photonic Die Coupling
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Solution Overview
Problem
Current methods for realizing optical communication among photonic dies are limited by package structures, restricting the flexibility and efficiency of optical signal transmission between integrated photonic integrated circuits (PICs).
Innovation Solution
A semiconductor package manufacturing method that includes forming wave guide patterns on a substrate, encapsulating photonic dies with a dielectric layer, and creating a wave guide structure using polymer layers to optically couple adjacent photonic dies, allowing for extended optical communication beyond the constraints of unsingulated photonic die configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If photonic dies are integrated using conventional package structures, then optical communication is achieved, but the flexibility and efficiency of optical signal transmission are restricted
Solution Approach 1:
The patent segments the photonic integration process by separately fabricating photonic dies on individual substrates before final packaging. This allows independent optimization of each die and enables flexible reconfiguration of optical pathways without being constrained by monolithic package structures.
Solution Approach 2:
The patent transitions from planar optical coupling to three-dimensional vertical stacking of photonic dies. By utilizing the vertical dimension, the system achieves higher integration density while maintaining optical signal transmission efficiency and flexibility through multiple coupling interfaces.
2Productivity
If photonic dies are singulated before packaging, then individual die processing is enabled, but optical communication efficiency decreases due to packaging constraints
Solution Approach 1:
The patent performs preliminary fabrication and optimization of photonic dies on large substrates before singulation. Waveguide patterns, optical components, and interconnections are established in advance, enabling efficient mass production while maintaining high optical transmission efficiency in the final packaged product.
Solution Approach 2:
The patent introduces intermediate carrier substrates that hold multiple photonic dies during fabrication and testing. These carriers serve as mediators, allowing individual die processing and optimization while preserving optical communication pathways that would be lost in direct singulated packaging.
3Reliability
If wave guide structure is formed to extend over encapsulated photonic dies, then signal loss is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes waveguide parameters such as width, height, and material composition to minimize optical signal loss. By carefully controlling these geometric and material parameters, the waveguide structure achieves high transmission efficiency while maintaining manufacturability through standard fabrication processes.
Solution Approach 2:
The patent employs composite material structures for waveguides, combining different materials with complementary optical properties. This includes using low-refractive-index materials for cladding and high-refractive-index materials for the waveguide core, creating optimized optical confinement while maintaining structural integrity and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and flexible optical communication between photonic dies by forming a wave guide structure that extends over the encapsulated photonic dies, reducing signal loss and overcoming packaging limitations, thus enhancing the performance of photonic integrated circuits.
Implementation Method 1
a wave guide structure that lies on the encapsulant and the photonic die, and extends into the opening to be optically coupled to the wave guide pattern
Data Source
AI summary
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a photonic die, an encapsulant and a wave guide structure. The photonic die includes: a substrate, having a wave guide pattern formed at front surface; and a dielectric layer, covering the front surface of the substrate, and having an opening overlapped with an end portion of the wave guide pattern. The encapsulant laterally encapsulates the photonic die. The wave guide structure lies on the encapsulant and the photonic die, and extends into the opening of the dielectric layer, to be optically coupled to the wave guide pattern.