Photonic-Electrical IC Package Layout for Shorter Signal Paths
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Solution Overview
Problem
Existing system-in-package (SiP) designs face challenges in achieving high transmission efficiency and reduced power consumption due to increased distances and conductive interconnect structures between photonic and electrical IC chips, leading to increased power consumption, heat generation, and latency.
Innovation Solution
A semiconductor package structure with a photonic IC chip directly adjacent to an electrical IC chip, utilizing optical signals for high-speed communication, and a 2.5D or 3D layout to minimize signal travel distance, reduce conductive interconnects, and enable efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photonic IC chip and electrical IC chip are separated by conductive interconnect structures, then electrical connection is established, but signal travel distance increases leading to higher power consumption and heat generation
Solution Approach 1:
The patent merges the photonic IC chip and electrical IC chip into direct physical contact, eliminating the need for separate conductive interconnect structures. The photonic chip is positioned adjacent to the electrical chip with direct coupling interfaces, reducing signal travel distance and power consumption while maintaining reliable electrical and optical connections.
Solution Approach 2:
The patent transitions from traditional vertical stacking to a lateral adjacent arrangement where the photonic IC chip is positioned beside the electrical IC chip. This dimensional change enables direct coupling interfaces to be formed at the edges of both chips, minimizing signal travel distance through the interconnect structures while maintaining reliable electrical connections.
2Productivity
If photonic IC chip and electrical IC chip are placed close together, then signal travel distance is reduced improving transmission efficiency, but heat dissipation becomes more challenging
Solution Approach 1:
The patent segments the heat dissipation function from the chip integration function by introducing dedicated heat dissipation structures (heat sinks, thermal vias, heat spreaders) that are separately optimized. The adjacent chip arrangement optimizes signal transmission, while the segmented heat dissipation structures manage thermal loads independently, resolving the contradiction between close placement for efficiency and heat management.
3Reliability
If traditional conductive interconnect structures are used between photonic and electrical IC chips, then electrical connection is established, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the electrical and optical interconnect functions into a unified adjacent chip architecture. By positioning the photonic IC chip directly adjacent to the electrical IC chip with complementary coupling interfaces, the design eliminates complex multi-layer conductive interconnect structures while maintaining reliable electrical connections through simplified direct coupling pathways.
Data Source
AI summary
Various embodiments of the present disclosure are directed towards a semiconductor package structure including a first integrated circuit (IC) chip overlying a base structure. An electrical IC chip overlies the base structure and is disposed around the first IC chip. The electrical IC chip is electrically coupled to the first IC chip. A photonic IC chip overlies the base structure and is electrically coupled to the electrical IC chip. The photonic IC chip is configured to receive an input optical signal. The photonic IC chip is adjacent to the electrical IC chip.