Photonic Engine and Laser Die Co-Packaging for Signal Conversion
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical signaling components efficiently, particularly in devices that require conversion between optical and electrical signals, leading to inefficiencies in signal transmission and processing.
Innovation Solution
A compact universal photonic engine (COUPE) is integrated with a laser diode through co-package processes, utilizing a silicon-on-insulator substrate with layered optical components and metallization layers to facilitate efficient signal conversion and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical and electrical signaling components are integrated in separate packages, then each component can be optimized independently, but signal transmission efficiency decreases and device complexity increases
Solution Approach 1:
The patent integrates optical components (laser die, optical waveguides) and electrical components (semiconductor die with electronic devices) into a single hybrid package, merging previously separate optical and electrical signaling systems. This integration enables direct coupling between optical and electrical domains, improving signal transmission efficiency while consolidating device structure rather than increasing complexity.
Solution Approach 2:
The patent introduces optical waveguides and coupling structures as intermediary elements that bridge the laser die and the semiconductor die. These intermediaries enable efficient optical-to-electrical signal conversion and transmission between the optical and electrical components, resolving the contradiction by providing a dedicated pathway for signal transfer within the integrated package.
2Productivity
If optical components are integrated with electrical components in the same package, then signal conversion efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent divides the integrated package into distinct functional modules: a laser die for optical signal generation, optical waveguides for signal transmission, and a semiconductor die with electronic devices for electrical signal processing. Each module can be manufactured and optimized independently using established processes, then assembled into the final integrated package. This segmentation maintains manufacturing simplicity while achieving high signal conversion efficiency.
Solution Approach 2:
The patent performs preliminary bonding of the laser die to the semiconductor die before final package assembly. The laser die is pre-aligned and bonded to the semiconductor die with precise positioning of optical components, ensuring optimal optical coupling is achieved before subsequent packaging steps. This preliminary action simplifies the overall manufacturing process by establishing critical connections early in the assembly sequence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration enables efficient conversion and transmission of optical and electrical signals, enhancing the performance of devices by optimizing signal processing and reducing inefficiencies.
Implementation Method 1
bonding a laser die over the metallization layers
Implementation Method 2
laser diode
Implementation Method 3
utilizing a silicon-on-insulator substrate with layered optical components
Implementation Method 4
a first mirror located within the laser die is aligned with a second mirror through the first opening
Implementation Method 5
a lens die comprises a first lens aligned with a third mirror through a second opening
Data Source
AI summary
Optical devices and methods of manufacture are presented in which metallization layers are formed over a first active layer of first optical components, a first opening is formed through the metallization layers, a first semiconductor die is bonded over the metallization layers, and a laser die is bonded over the metallization layers, wherein after the bonding the laser die a first mirror located within the laser die is aligned with a second mirror through the first opening.