Photonic Engine Package with SOI Vias for Die Integration
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Solution Overview
Problem
The increasing demand for high-performance applications in integrated circuits necessitates improved signal communication through optical signals, which current packaging technologies struggle to efficiently integrate and interconnect device dies effectively.
Innovation Solution
The use of a Silicon-On-Insulator (SOI) substrate with photonic devices, including waveguides, reflectors, and electronic dies, bonded with a redistribution structure and thinned semiconductor layer to form a photonic engine package, enhancing optical signal transfer and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical signals are used for signal communications, then high speed and low latency are achieved, but integration and interconnection of device dies becomes difficult
Solution Approach 1:
The patent merges photonic devices and electronic devices into a single integrated photonic engine package. Multiple device dies are bonded together on a common substrate, combining optical signal generation, modulation, and detection functions with electronic control circuits, thereby achieving high-speed optical communication while simplifying integration through unified packaging
Solution Approach 2:
The patent introduces optical interconnect structures as intermediaries between device dies. These optical interconnects serve as mediators that transfer signals between separate dies using light instead of electrical connections, enabling high-speed communication while maintaining physical separation of functional blocks for easier integration
2Use of energy by moving object
If semiconductor layer is thinned, then light-collecting efficiency is improved, but mechanical strength is reduced
Solution Approach 1:
The patent employs composite material structures in the thinned semiconductor layer, combining multiple materials with complementary properties. The composite structure maintains mechanical strength through reinforcing phases while preserving the thin profile needed for efficient light collection, resolving the contradiction between strength and optical performance
Solution Approach 2:
The patent applies local quality enhancement by selectively reinforcing specific regions of the thinned semiconductor layer. Areas requiring mechanical support receive additional structural reinforcement, while regions requiring optical access maintain their thin configuration, optimizing both strength and light-collecting efficiency in their respective locations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves light-collecting efficiency and reduces mechanical damage, while maintaining optical signal transfer capabilities, making it suitable for high-performance applications.
Implementation Method 1
optical signals are increasingly used for signal communications due to their high speed and low latency
Implementation Method 2
packages with photonic engines... improving light-collecting efficiency
Data Source
AI summary
A method includes patterning a top silicon layer in a substrate to form a plurality of photonic devices. The substrate includes the top silicon layer, a first dielectric layer under the top silicon layer, and a semiconductor layer under the first dielectric layer. The method further includes forming a second dielectric layer to embed the plurality of photonic devices therein, forming an interconnect structure over and signally coupling to the plurality of photonic devices, bonding an electronic die to the interconnect structure, thinning the semiconductor layer, and patterning the semiconductor layer that has been thinned to form openings. The openings are filled with a dielectric material to form dielectric regions. Through-vias are formed to penetrate through the dielectric regions to electrically couple to the interconnect structure.