Photonic Guiding Device Large Core Hollow Waveguide
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Solution Overview
Problem
The challenge in interconnecting high-speed computer chips on circuit boards is the inaccuracy and time-consuming process of physically placing fiber optics, leading to a communications bottleneck, as conventional optical interconnects are lossy and costly, with polymer waveguides having significantly higher losses than fiber optics and being difficult to manufacture with the necessary tolerances.
Innovation Solution
The development of a photonic guiding device featuring a large core hollow waveguide with a reflective cladding layer, utilizing attenuated total internal reflection instead of total internal reflection, which is formed using lithographic processes on substrates, and includes a collimating lens to reduce losses and facilitate easier connection and splitting of optical beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If fiber optics are physically placed to interconnect high-speed computer chips, then broadband data transfer capability is achieved, but manufacturing accuracy and time consumption increase significantly
Solution Approach 1:
The patent replaces the mechanical system of physically placing and connecting fiber optic cables with an integrated photonic guiding device that is formed directly on the circuit board using lithographic processes. This substitution eliminates the need for manual fiber placement and mechanical connection, thereby achieving broadband data transfer without the associated manufacturing precision and time consumption issues.
Solution Approach 2:
The patent merges the fiber optic interconnect function directly into the circuit board structure by forming waveguides and coupling regions within the board layers. This integration combines the electrical circuitry and optical interconnects into a single manufactured component, eliminating the need for separate fiber placement operations and achieving both electrical and optical functionality in one manufacturing process.
2Loss of information
If conventional optical interconnects are used, then data transfer is enabled, but signal loss and manufacturing cost increase
Solution Approach 1:
The patent changes the physical parameters of the optical interconnect by using a large core diameter waveguide structure with a core size of 10-100 micrometers, which is significantly larger than conventional single-mode fibers. This parameter change reduces signal loss by enabling easier coupling between components and reducing sensitivity to alignment errors, while also simplifying the manufacturing process and reducing costs.
Solution Approach 2:
The patent segments the optical interconnect into distinct functional regions within the circuit board, including input coupling regions, waveguide propagation regions, and output coupling regions. This segmentation allows each region to be optimized for its specific function while being manufactured as an integrated structure, reducing overall signal loss and simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a low-loss, cost-effective means for interconnecting components on circuit boards, enabling efficient broadband data transfer with reduced attenuation and manufacturing complexity, allowing for the use of larger waveguides that are easier and less expensive to connect, and enabling the transmission of high data rates.
Implementation Method 1
a reflective coating formed of one or more layers of metal, dielectric, or other substantially reflective material at the wavelength of the optical signal
Implementation Method 2
coupled with a collimating lens to reduce attenuation and facilitate low-loss, cost-effective optical interconnects between chips
Data Source
AI summary
A photonic guiding device and methods of making and using are disclosed. The photonic guiding device comprises a large core hollow waveguide configured to interconnect electronic circuitry on a circuit board. A reflective coating covers an interior of the hollow waveguide to provide a high reflectivity to enable light to be reflected from a surface of the reflective coating. A collimator is configured to collimate multi-mode coherent light directed into the hollow waveguide.