Photonic IC Seal Ring Recess Layout for Dicing Stress Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor manufacturing processes face challenges in protecting integrated circuits from stress during the wafer dicing process, leading to potential damage and delamination of circuit components.
Innovation Solution
The implementation of a seal ring structure with a recessed design around the interconnection layer, which includes multiple dielectric and conductive layers, provides mechanical protection and allows for optical signal exchange through edge-coupling, effectively preventing stress-induced damage during sawing operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a seal ring structure is added to protect the integrated circuit from stress during dicing, then the reliability of the circuit is improved, but the device complexity increases
Solution Approach 1:
The seal ring structure is formed by nesting multiple material layers (first material layer, second material layer, third material layer) within each other to create a protective structure. The first material layer is deposited over the interconnection layer, the second material layer is deposited over the first material layer, and the third material layer is deposited over the second material layer, forming a nested protective configuration that provides stress protection during dicing operations.
2Reliability
If the seal ring structure includes multiple material layers, then the protection effectiveness is improved, but the manufacturing process complexity increases
Solution Approach 1:
The seal ring structure is formed preliminarily during the back-end of line semiconductor processes, before the dicing operation. The multiple material layers are deposited and patterned in advance to create the protective structure that will prevent stress-induced damage during subsequent wafer dicing and singulation operations.
3Adaptability or versatility
If the seal ring structure is formed with recesses, then the optical signal transmission is enabled, but the manufacturing precision requirements increase
Solution Approach 1:
The seal ring structure incorporates recesses at specific locations to enable optical signal exchange while maintaining protective functionality. The recesses are formed in the patterned material layers to create localized openings that allow optical coupling between waveguides, while the surrounding sealed structure continues to provide stress protection. This local modification approach enables optical functionality without compromising the overall protective seal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The seal ring structure effectively protects the photonic integrated circuits from stress during sawing while enabling efficient optical signal transmission, ensuring the integrity and functionality of the silicon waveguides and other components.
Implementation Method 1
seal ring structure provides mechanical protection and allows for optical signal exchange through edge-coupling, effectively preventing stress-induced damage during sawing operations
Implementation Method 2
allows for optical signal exchange through edge-coupling, ensuring the integrity and functionality of the silicon waveguides
Data Source
AI summary
A photonic integrated circuit includes a substrate, an interconnection layer, and a plurality of silicon waveguides. The interconnection layer is over the substrate. The interconnection layer includes a seal ring structure and an interconnection structure surrounded by the seal ring structure. The seal ring structure has at least one recess from a top view. The recess concaves towards the interconnection structure. The silicon waveguides are embedded in the substrate.